Datasheet > AFBR-5725PZ

AFBR-5725PZ

更新时间： 2024-01-06 23:15:48

品牌	Logo	应用领域
安华高科 - AVAGO		通信监视器光纤
页数	文件大小	规格书
2页	37K
描述
FIBER OPTIC TRANSCEIVER

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技术参数
数据手册

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AFBR-5725PZ 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	compliant	风险等级：	5.84
其他特性：	DETECTOR TYPE-MONITOR DIODE	通信标准：	GBE, TELCORDIA
发射极/检测器类型：	VCSEL LASER, PHOTODIODE	光纤设备类型：	TRANSCEIVER
Base Number Matches：	1

AFBR-5725PZ 数据手册

AFBR-5725PZ

1.25GBd Ethernet, 850nm, 1000Base-SX

SFP Transceiver

Reliability Data Sheet

Introduction

FIT Rate Summary

Avago Technologies Quality System includes an on-going The FIT rate for AFBR-5725PZ is calculated to be 105.

Reliability Monitoring program to generate a database

The details of this calculation are included on page 2 of

from which this reliability datasheet is published.

this report. Reliability prediction follows the parts count

method of Telcordia-SR-332 Issue 3.

Description

The AFBR-5725PZ optical transceiver is compliant with the Random Failure Rate (FIT) Calculation

speciﬁcations set forth in both the IEEE802.3 (1000BASE-

Failure in time rate, or FIT, is deﬁned as the number of

SX), and the Small Form-Factor Pluggable (SFP) Multi-

failures per billion device hours. In the product useful life

Source Agreement (MSA). Its primary application is to

region, the random failure rate is considered as a constant

serve Gigabit Ethernet links between optical networking

failure rate. In this region MTTF, Mean Time to Failure, is

equipment. It oﬀers system cost, upgrade, and reliability

deﬁned as MTTF = 1/FIT.

beneﬁts by virtue of being hot-pluggable. Further, it in-

corporates the latest 3.3 VDC compatible transceiver tech- FIT Prediction Based on Telcordia SR-332 Parts Count Pro-

nology including an 850 nm VCSEL transmitter as well as a cedure

convenient LC-Duplex optical interface.

The Telcordia parts count method assumes that the mod-

ule failure rate is equal to the sum of the device compo-

nent failure rates. Modiﬁers are included to take into con-

sideration variations in module operation environments,

device quality requirements, temperature, and stress. The

table that follow show the FIT for the components used in

the modules and the total FIT which have been calculated

for an operating ambient temperature of 40C

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