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ADuM5401ARWZ

更新时间: 2024-01-10 10:17:16
品牌 Logo 应用领域
亚德诺 - ADI 转换器光电二极管
页数 文件大小 规格书
28页 539K
描述
Quad-Channel, 2.5 kV Isolators with Integrated DC-to-DC Converter

ADuM5401ARWZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOP,针数:16
Reach Compliance Code:unknown风险等级:5.57
Is Samacsys:N模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G16JESD-609代码:e3
长度:10.3 mm湿度敏感等级:1
功能数量:1端子数量:16
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):225座面最大高度:2.65 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.5 mmBase Number Matches:1

ADuM5401ARWZ 数据手册

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Data Sheet  
ADuM5401/ADuM5402/ADuM5403/ADuM5404  
REVISION HISTORY  
6/12—Rev. B to Rev. C  
Changes to DC Correctness and Magnetic Field Immunity  
Section ..............................................................................................21  
Changes to Power Consumption Section and Figure 29 ...........22  
Changes to Power Considerations................................................23  
Added Increasing Available Power Section and Table 26..........23  
Added Table 27................................................................................24  
Changes to Insulation Lifetime Section .......................................24  
Created Hyperlink for Safety and Regulatory Approvals  
Entry in Features Section .................................................................1  
Updated Outline Dimensions........................................................26  
9/11—Rev. A to Rev. B  
Changes to Product Title, Features Section, and General  
Description Section...........................................................................1  
Added Table 1; Renumbered Sequentially.....................................1  
Changes to Specifications Section...................................................3  
Changes to Table 19 and Table 20.................................................11  
Changes to Table 21 ........................................................................12  
Changes to Table 22 ........................................................................13  
Changes to Table 23 ........................................................................14  
Changes to Table 24 and Table 25.................................................15  
Changes to Figure 11 to Figure 13 ................................................16  
Changes to Figure 11, Figure 12 Caption, Figure 14 Caption,  
and Figure 16 Caption ....................................................................16  
Added Figure 19 and Figure 20; Renumbered Sequentially......17  
Changes to Figure 21 and Figure 22 .............................................17  
Changes to Terminology Section ..................................................19  
Changes to Applications Information Section ............................20  
Deleted Increasing Available Power, Figure 15, and Figure 16;  
Renumbered Sequentially ..............................................................20  
Changes to PCB Layout Section....................................................20  
Added Start-Up Behavior Section.................................................21  
Moved and Changes to EMI Considerations Section ................21  
11/08—Rev. 0 to Rev. A  
Changes to Figure 1 and General Description Section................1  
Changes to Table 1 ............................................................................3  
Changes to Table 2 ............................................................................5  
Changes to Table 4 ............................................................................7  
Changes to Table 6 and Table 7 .......................................................8  
Changes to Table 8 and Table 9 .......................................................9  
Changes to Figure 7 and Table 10 .................................................10  
Changes to Figure 8 and Table 11 .................................................11  
Changes to Figure 9 and Table 12 .................................................12  
Changes to Figure 10 and Table 13...............................................13  
Moved Truth Table Section............................................................13  
Changes to Applications Information Section and PCB Layout  
Section ..............................................................................................17  
Changes to DC Correctness and Magnetic Field Immunity  
Section ..............................................................................................18  
Changes to Power Considerations Section..................................20  
Added Increasing Available Power Section, Table 15,  
and Table 16 .....................................................................................20  
5/08—Revision 0: Initial Version  
Rev. C | Page 3 of 28  
 

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