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ADT7301ARMZ-REEL PDF预览

ADT7301ARMZ-REEL

更新时间： 2024-02-28 04:40:20
品牌 Logo 应用领域
亚德诺 - ADI 传感器温度传感器
页数 文件大小 规格书
14页 561K
描述
Switch/Digital Output Temperature Sensor, DIGITAL TEMP SENSOR-SERIAL, 13BIT(s), 4Cel, SQUARE, SURFACE MOUNT, LEAD FREE, PLASTIC, MO-187AA, MSOP-8

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ADT7301ARMZ-REEL 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Obsolete包装说明：TSOP6,.11,37
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：5.3
最大精度（摄氏度）：4 Cel主体宽度：1.6 mm
主体高度：1.15 mm主体长度或直径：2.9 mm
外壳：PLASTICJESD-609代码：e3
安装特点：SURFACE MOUNT位数：13
端子数量：6最大工作电流：2.2 mA
最高工作温度：150 °C最低工作温度：-40 °C
输出接口类型：4-WIRE INTERFACE封装主体材料：PLASTIC/EPOXY
封装等效代码：TSOP6,.11,37封装形状/形式：RECTANGULAR
电源：3/5 V传感器/换能器类型：TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
子类别：Other Sensors最大供电电压：5.5 V
最小供电电压：2.7 V表面贴装：YES
温度系数：NEGATIVE/POSITIVE ppm/ °C端子面层：Matte Tin (Sn)
端接类型：SOLDERBase Number Matches：1

ADT7301ARMZ-REEL 数据手册

 浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第2页浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第3页浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第4页浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第6页浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第7页浏览型号ADT7301ARMZ-REEL的Datasheet PDF文件第8页 
Preliminary Technical Data  
ADT73±1  
ABSOLUTE MAXIMUM RATINGS  
Table 3. ADT7301 Stress Ratings  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−40°C to +150°C  
−65°C to +150°C  
+150°C  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Operating Temperature Range1  
Storage Temperature Range  
Junction Temperature  
6-Lead SOT-23 (RJ-6)  
Power Dissipation2  
3
1.2  
1.0  
0.8  
WMAX = (TJMAX - TA )/θJA  
Thermal Impedance  
θJA, Junction-to-Ambient (still air) 190.4°C/W  
8-Lead MSOP (RM-8)  
3)  
Power Dissipation2  
Thermal Impedance4  
WMAX = (TJMAX - TA /θJA  
SOT-23  
0.6  
θJA, Junction-to-Ambient (still air) 205.9°C/W  
θJC, Junction-to-Case  
IR Reflow Soldering  
Peak Temperature  
Time at Peak Temperature  
Ramp-up Rate  
43.74°C/W  
MSOP  
0.4  
0.2  
0
+220°C (−0/+5°C)  
10 s to 20 s  
2°C/s to 3°C/s  
−6°C/sec  
Ramp-down Rate  
TEMPERATURE (°C)  
1It is not recommended to operate the ADT7301 at temperatures above 125°C  
for greater than a total of 5% of the lifetime of the device. Any exposure  
beyond this limit will affect device reliability.  
Figure 3. Plot of Maximum Power Dissipation vs. Temperature  
2Values relate to package being used on a standard 2-layer PCB. Reference  
Figure 3 for a plot of maximum power dissipation versus ambient  
temperature (TA).  
3TA = ambient temperature  
4Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, e.g., components mounted on a heat sink.  
Junction-to-ambient resistance is more useful for air-cooled, PCB mounted  
components.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the  
human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. PrJ | Page 5 of 14  
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