ADT7301
ABSO LU T E M AXIM U M RAT IN G S1
Preliminary Technical Data
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V
Digital Output Voltage to GND . . . . . –0.3 V to VDD + 0.3 V
Operating T emperature Range2 . . . . . –40°C to +150°C
Storage T emperature Range . . . . . . . . –65°C to +150°C
Junction T emperature . . . . . . . . . . . . . . . . . . . . . . +150°C
6-Lead SOT -23 (RJ-6) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power D issipation3 . . . . . . . WMAX = (TJMAX - TA4)/θJA
T hermal Impedance
I
200A
OL
TO
OUTPUT
PIN
+1.6V
C
L
50pF
200A
I
OH
θ
JA, Junction-to-Ambient (still air) . . . 190.4°C /W
8-Lead M SOP (RM -8) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power D issipation3 . . . . . . . WMAX = (TJMAX - TA4)/θJA
T hermal Impedance5
Figure 1. Load Circuit for Data Access Tim e and Bus
Relinquish Tim e
θJA, Junction-to-Ambient (still air) . . . 205.9°C /W
θ
JC , Junction-to-C ase . . . . . . . . . . . . . . 43.74°C /W
IR Reflow Soldering
Peak T emperature . . . . . . . . . . . . +220°C (-0/+5°C)
T ime at Peak T emperature . . . . . . . . . . 10 to 20 secs
Ramp-up Rate . . . . . . . . . . . . . . . . . . . . . . . 2-3°C /sec
Ramp-down Rate . . . . . . . . . . . . . . . . . . . . . . -6°C /sec
1.2
1
1
Stresses above those listed under Absolute M axim um Ratings m ay
0.8
cause permanent damage to the device. T his is
a stress rating only;
functional operation of the device at these or any other conditions above
those indicated in the operational section of this specification is not
im plied . Exposu re to absolu te m axim u m ratin g con d ition s for ex-
tended periods may affect device reliability.
SOT-23
0.6
MSOP
2
3
It is not recommended to operate the device at temperatures above
0.4
+125°C for greater than
a total of 5% of the lifetime of the device. Any
exposure beyond this limit will affect device reliability.
Values relate to package being used on a standard 2-layer pcb. Reference
0.2
0
Figure 2. for
(T A).
a plot of max power dissipation vs. ambient temperature
4T A
5Junction-to-C ase resistance is applicable to com ponents featuring
preferential flow direction, eg. components mounted on heat sink.
= Am bient T em perature.
-40 -30 -20 -10
0
10 20 30 40 50 60 70
80 90 100 110 120 125 130 140 150
Temperature - °C
a
a
Ju n ction -to-Am bien t resistan ce is m ore u sefu l for air-cooled P C B-
m ou n ted com pon en ts.
Figure 2. Plot of Maxim um Power Dissipation vs. Tem -
perature
TIMING CHARACTERISTICS1, 2, 3
(T = TMIN to T , V = +2.7 V to +5.5 V, unless otherwise noted)
A
MAX DD
Parameter
Lim it
U nits
C omments
t1
t2
t3
0
ns min
ns min
ns min
ns max
CS to SCLK Setup T ime
25
25
35
SCLK H igh Pulsewidth
SCLK Low Pulsewidth
4
t4
Data Access T ime After SCLK Falling Edge
t5
t6
t7
20
0
ns min
ns min
ns min
ns max
Data Setup T ime Prior to SCLK Rising Edge
Data H old T ime After SCLK Rising Edge
CS to SCLK H old T ime
0
40
4
t8
CS to DOUT H igh Impedance
N O T E S
1G uaranteed by design and characterization, not production tested.
2All input signals are specified with tr
3See F igure 2.
= tf = 5 ns (10% to 90% of VDD) and timed from a voltage level of 1.6 V.
4M easured with the load circuit of Figure 1.
–4 –
REV. PrE
5秒后页面跳转
PCF8574资料解读：主要参数分析、引脚说明
AD637数据手册解读：主要特性、引脚及其功能解读、电气参数
ADUM1201资料手册解读：参数分析、引脚说明、应用分析
一文带你了解压敏电阻器在直流电路中的过压保护作用
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
