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ADT7301 PDF预览

ADT7301

更新时间: 2024-01-17 22:03:47
品牌 Logo 应用领域
德州仪器 - TI 转换器
页数 文件大小 规格书
16页 286K
描述
13-bit temperature-to-digital converter −40°C to 150°C operating temperature range ±0.5°C typical accuracy

ADT7301 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete包装说明:TSOP6,.11,37
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.3
最大精度(摄氏度):4 Cel主体宽度:1.6 mm
主体高度:1.15 mm主体长度或直径:2.9 mm
外壳:PLASTICJESD-609代码:e3
安装特点:SURFACE MOUNT位数:13
端子数量:6最大工作电流:2.2 mA
最高工作温度:150 °C最低工作温度:-40 °C
输出接口类型:4-WIRE INTERFACE封装主体材料:PLASTIC/EPOXY
封装等效代码:TSOP6,.11,37封装形状/形式:RECTANGULAR
电源:3/5 V传感器/换能器类型:TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
子类别:Other Sensors最大供电电压:5.5 V
最小供电电压:2.7 V表面贴装:YES
温度系数:NEGATIVE/POSITIVE ppm/ °C端子面层:Matte Tin (Sn)
端接类型:SOLDERBase Number Matches:1

ADT7301 数据手册

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ADT7301  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
VDD to GND  
−0.3 V to +7 V  
−0.3 V to VDD + 0.3 V  
−0.3 V to VDD + 0.3 V  
−40°C to +150°C  
−65°C to +150°C  
150°C  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
Operating Temperature Range1  
Storage Temperature Range  
Junction Temperature  
6-Lead SOT-23 (RJ-6)  
Power Dissipation2  
1.2  
1.0  
0.8  
3
WMAX = (TJ max − TA )/θJA  
Thermal Impedance  
θJA, Junction-to-Ambient  
(Still Air)  
190.4°C/W  
SOT-23  
8-Lead MSOP (RM-8)  
Power Dissipation2  
Thermal Impedance4  
θJA, Junction-to-Ambient  
(Still Air)  
θJC, Junction-to-Case  
IR Reflow Soldering  
Peak Temperature  
Time at Peak Temperature  
Ramp-Up Rate  
0.6  
3
WMAX = (TJ max − TA )/θJA  
MSOP  
0.4  
0.2  
0
205.9°C/W  
43.74°C/W  
220°C (0°C/5°C)  
10 sec to 20 sec  
3°C/s max  
TEMPERATURE (°C)  
Figure 3. Plot of Maximum Power Dissipation vs. Temperature  
Ramp-Down Rate  
−6°C/s max  
Time 25°C to Peak Temperature  
IR Reflow Soldering—Pb-Free Package  
Peak Temperature  
6 minutes max  
ESD CAUTION  
260°C (0°C)  
Time at Peak Temperature  
Ramp-Up Rate  
20 sec to 40 sec  
3°C/s max  
Ramp-Down Rate  
−6°C/s max  
Time 25°C to Peak Temperature  
8 minutes max  
1 It is not recommended to operate the ADT7301 at temperatures above  
125°C for greater than a total of 5% (5,000 hours) of the lifetime of the  
device. Any exposure beyond this limit affects device reliability.  
2 Values relate to the package being used on a standard 2-layer PCB. Refer  
to Figure 3 for a plot of maximum power dissipation vs. ambient  
temperature (TA).  
3 TA = ambient temperature.  
4 Junction-to-case resistance is applicable to components featuring a  
preferential flow direction, for example, components mounted on a heat  
sink. Junction-to-ambient resistance is more useful for air-cooled,  
PCB-mounted components.  
Rev. B | Page 5 of 16  
 
 
 

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