ADT6501/ADT6502/ADT6503/ADT6504
Preliminary Technical Data
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rating
VCC to GND
–±.3 V to +7 V
–±.3 V to VCC + ±.3 V
–±.3 V to +7 V
–±.3 V to VDD + ±.3 V
2± mA
HYST Input Voltage to GND
Open Drain Output Voltage to GND
Push-Pull Output Voltage to GND
Input Current on All Pins
Output Current on All Pins
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, TJMAX
5-Lead SOT-23 (RJ-5)
Power Dissipation2
Thermal Impedance4
θJA, Junction-to-Ambient (still air)
IR Reflow Soldering (Pb-Free Package)
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
2± mA
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
–55°C to +125°C
–65°C to +16±°C
15±.7°C
3
WMAX = (TJMAX − TA )/θJA
24±°C/W
26±°C (+±°C)
2± sec to 4± sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
0.1
SOT-23 PD @ 125°C = 0.107W
0
Ramp-Down Rate
Time 25°C to Peak Temperature
–55 –40 –20
0
20
40
60
80
100 120
–50 –30 –10
10
30
50
70
90 110 125
TEMPERATURE (°C)
1 Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θJA. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (TA).
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
2 TA = ambient temperature.
3 Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4±±± V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. PrA | Page 4 of 16