Datasheet > ADP3339AKC-18

ADP3339AKC-18

更新时间： 2022-11-25 11:05:36

品牌	Logo	应用领域
亚德诺 - ADI		稳压器
页数	文件大小	规格书
8页	208K
描述
High-Accuracy Ultralow IQ, 1.5 A, anyCAP Low Dropout Regulator

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ADP3339AKC-18 数据手册

ADP3339

CALCULATING POWER DISSIPATION

Device power dissipation is calculated as follows:

P_D= V − V_OUT× I

+ V

× I

GND

(

)

(

)

LOAD

Where I_LOADand I_GNDare load current and ground current, V_IN

and V_OUTare the input and output voltages respectively.

Assuming worst-case operating conditions are I_LOAD= 1.5 A,

_GND= 14 mA, V_IN= 3.3 V, and V_OUT= 2.5 V, the device power

dissipation is:

Figure 4. PCB Layouts

P = 3.3V – 2.5V 1500 mA + 3.3V 14 mA = 1246 mW

Use the following general guidelines when designing printed

circuit boards:

(

)

(

)

So, for a maximum junction temperature of 125°C and a

maximum ambient temperature of 85°C, the required ther-

mal resistance from junction to ambient is:

1. Keep the output capacitor as close to the output and ground

pins as possible.

2. Keep the input capacitor as close to the input and ground

pins as possible.

125°C − 85°C

1.246W

θ_JA

= 32.1°C/W

3. PC board traces with larger cross sectional areas will remove

more heat from the ADP3339. For optimum heat transfer,

specify thick copper and use wide traces.

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

4. The thermal resistance can be decreased by adding a copper

pad under the ADP3339 as shown in Figure 4b.

The SOT-223’s thermal resistance, θ_JA, is determined by the

sum of the junction-to-case and the case-to-ambient thermal

resistances. The junction-to-case thermal resistance, θ_JC, is

determined by the package design and specified at 26.8°C/W.

However, the case-to-ambient thermal resistance is determined

by the printed circuit board design.

5. If possible, utilize the adjacent area to add more copper

around the ADP3339. Connecting the copper area to the

output of the ADP3339, as shown in Figure 4c, is best but

will improve thermal performance even if it is connected to

other pins.

As shown in Figures 4a–4c, the amount of copper to which the

ADP3339 is mounted affects the thermal performance. When

mounted to just the minimal pads of 2 oz. copper (Figure 4a),

the θ_JAis 126.6°C/W. By adding a small copper pad under the

ADP3339 (Figure 4b), reduces the θ_JAto 102.9°C/W. Increasing

the copper pad to 1 square inch (Figure 4c), reduces the θ_JA

even further to 52.8°C/W.

6. Use additional copper layers or planes to reduce the thermal

resistance. Again, connecting the other layers to the output

of the ADP3339 is best, but not necessary. When connecting

the output pad to other layers use multiple vias.

REV. 0

–7–

1...4 5 678

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