ADP3120A
MAXIMUM RATINGS
Rating
Value
0 to 85
0 to 150
Unit
°C
Operating Ambient Temperature, T
A
Operating Junction Temperature, T (Note 1)
°C
J
Package Thermal Resistance: SO−8
Junction−to−Case, R
45
123
°C/W
°C/W
q
JC
Junction−to−Ambient, R
(2−Layer Board)
q
JA
Package Thermal Resistance: DFN8 (Note 2)
Junction−to−Case, R (From die to exposed pad)
q
JC
7.5
55
°C/W
°C/W
Junction−to−Ambient, R
q
JA
Storage Temperature Range, T
−65 to 150
260 peak
1
°C
°C
−
S
Lead Temperature Soldering (10 sec): Reflow (SMD styles only)
JEDEC Moisture Sensitivity Level
Pb−Free (Note 3)
SO−8 (260 peak profile)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Internally limited by thermal shutdown, 150°C min.
2
2. 2 layer board, 1 in Cu, 1 oz thickness.
3. 60−180 seconds minimum above 237°C.
NOTE: This device is ESD sensitive. Use standard ESD precautions when handling.
MAXIMUM RATINGS
Pin Symbol
Pin Name
Main Supply Voltage Input
Ground
V
V
MIN
MAX
V
CC
15 V
0 V
−0.3 V
0 V
PGND
BST
Bootstrap Supply Voltage Input
35 V wrt/PGND
40 V < 50 ns wrt/PGND
15 V wrt/SW
−0.3 V wrt/SW
SW
Switching Node
(Bootstrap Supply Return)
35 V
40 V < 50 ns
−5.0 V
−10 V < 200 ns
DRVH
DRVL
High−Side Driver Output
BST + 0.3 V
−0.3 V wrt/SW
−2.0 V < 200 ns wrt/SW
Low−Side Driver Output
V
CC
+ 0.3 V
−0.3 V DC
−5.0 V < 200 ns
IN
DRVH and DRVL Control Input
Output Disable
6.5 V
6.5 V
−0.3 V
−0.3 V
OD
NOTE: All voltages are with respect to PGND except where noted.
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