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ADP2138ACBZ-1.0-R7 PDF预览

ADP2138ACBZ-1.0-R7

更新时间： 2024-01-27 10:14:12
品牌 Logo 应用领域
亚德诺 - ADI 开关
页数 文件大小 规格书
20页 548K
描述
Compact, 800 mA, 3 MHz, Step-Down DC-to-DC Converter

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ADP2138ACBZ-1.0-R7 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：VFBGA, BGA6,2X3,20针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.66
模拟集成电路 - 其他类型：SWITCHING REGULATOR控制模式：CURRENT-MODE
控制技术：PULSE WIDTH MODULATION最大输入电压：5.5 V
最小输入电压：2.3 V标称输入电压：3.6 V
JESD-30 代码：R-PBGA-B6JESD-609代码：e3
长度：1.505 mm湿度敏感等级：1
功能数量：1端子数量：6
最高工作温度：125 °C最低工作温度：-40 °C
最大输出电流：1.65 A标称输出电压：1 V
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA6,2X3,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH峰值回流温度（摄氏度）：260
认证状态：Not Qualified座面最大高度：0.64 mm
子类别：Switching Regulator or Controllers表面贴装：YES
切换器配置：BUCK最大切换频率：3400 kHz
温度等级：AUTOMOTIVE端子面层：Matte Tin (Sn)
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：30
宽度：1.03 mmBase Number Matches：1

ADP2138ACBZ-1.0-R7 数据手册

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ADP2138/ADP2139  
Data Sheet  
6
5
4
3
THERMAL CONSIDERATIONS  
Because of the high efficiency of the ADP2138/ADP2139, only a  
small amount of power is dissipated inside the ADP2138/ADP2139  
package, which reduces thermal constraints.  
However, in applications with maximum loads at high ambient  
temperature, low supply voltage, and high duty cycle, the heat  
dissipated in the package is great enough that it may cause the  
junction temperature of the die to exceed the maximum junc-  
tion temperature of 125°C. If the junction temperature exceeds  
150°C, the converter enters thermal shutdown. It recovers when  
the junction temperature falls below 130°C.  
2
1
0
The junction temperature of the die is the sum of the ambient  
temperature of the environment and the temperature rise of the  
package due to power dissipation, as shown in the following  
equation:  
0
1
2
3
4
5
6
DC BIAS VOLTAGE (V)  
Figure 35. Typical Capacitor Performance  
The peak-to-peak output voltage ripple for the selected output  
capacitor and inductor values is calculated using the following  
equation:  
TJ = TA + TR  
where:  
VIN  
×2×L×COUT  
IRIPPLE  
8× fSW ×COUT  
TJ is the junction temperature.  
TA is the ambient temperature.  
TR is the rise in temperature of the package due to power  
dissipation.  
VRIPPLE  
=
=
(
2π × fSW  
)
Capacitors with lower equivalent series resistance (ESR) are  
preferred to guarantee low output voltage ripple, as shown in  
the following equation:  
The rise in temperature of the package is directly proportional  
to the power dissipation in the package. The proportionality  
constant for this relationship is the thermal resistance from the  
junction of the die to the ambient temperature, as shown in the  
following equation:  
VRIPPLE  
IRIPPLE  
ESRCOUT  
≤
The effective capacitance needed for stability, which includes  
temperature and dc bias effects, is 3 µF.  
TR = θJA × PD  
where:  
Table 7. Suggested 4.7 μF Capacitors  
TR is the rise in temperature of the package.  
Case  
Size  
Voltage  
Rating (V)  
Vendor  
Type  
X5R  
X5R  
X5R  
Model  
θ
JA is the thermal resistance from the junction of the die to the  
Murata  
Taiyo Yuden  
Coilcraft TDK  
GRM188R60J475  
JMK107BJ475  
C1608X5R0J475  
0603  
0603  
0603  
6.3  
6.3  
6.3  
ambient temperature of the package.  
PD is the power dissipation in the package.  
PCB LAYOUT GUIDELINES  
Input Capacitor  
Poor layout can affect ADP2138/ADP2139 performance, causing  
EMI and electromagnetic compatibility problems, ground  
bounce, and voltage losses. Poor layout can also affect regulation  
and stability. To implement a good layout, use the following rules:  
Higher value input capacitors help to reduce the input voltage  
ripple and improve transient response. Maximum input  
capacitor current is calculated using the following equation:  
•
Place the inductor, input capacitor, and output capacitor  
close to the IC using short tracks. These components carry  
high switching frequencies, and large tracks act as antennas.  
Route the output voltage path away from the inductor and  
SW node to minimize noise and magnetic interference.  
Maximize the size of ground metal on the component side  
to help with thermal dissipation.  
Use a ground plane with several vias connecting to the com-  
ponent side ground to further reduce noise interference on  
sensitive circuit nodes.  
VOUT (VIN −VOUT  
)
ICIN ≥ ILOAD(MAX)  
VIN  
•
•
•
To minimize supply noise, place the input capacitor as close to  
the VIN pin of the ADP2138/ADP2139 as possible. As with the  
output capacitor, a low ESR capacitor is recommended. The list  
of recommended capacitors is shown in Table 8.  
Table 8. Suggested 4.7 μF Capacitors  
Case  
Size  
Voltage  
Rating (V)  
Vendor  
Type  
X5R  
X5R  
X5R  
Model  
Murata  
GRM188R60J475  
JMK107BJ475  
C1608X5R0J475  
0603  
0603  
0603  
6.3  
6.3  
6.3  
Taiyo Yuden  
Coilcraft TDK  
Rev. C | Page 14 of 20  
 
 
 
 
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