ADP195
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Junction-to-ambient thermal resistance (θJA) of the package is
based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high
maximum power dissipation exists, close attention to thermal
board design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The speci-
fied values of θJA are based on a 4-layer, 4 inch × 3 inch PCB.
See JESD51-7 and JESD51-9 for detailed information regarding
board construction. For additional information, see the AN-617
application note, MicroCSPTM Wafer Level Chip Scale Package.
Parameter
Rating
VIN, VIN1, VIN2 to GND
VOUT, VOUT1, VOUT2 to GND
EN to GND
−0.3 V to +4.0 V
−0.3 V to +4.0 V
−0.3 V to +4.0 V
Continuous Drain Current
TA = 25°C
2 A
TA = 85°C
1.1 A
Continuous Diode Current
Storage Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Soldering Conditions
−50 mA
−65°C to +150°C
−40°C to +125°C
−40°C to +85°C
JEDEC J-STD-020
Ψ
JB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. The JESD51-12 document,
Guidelines for Reporting and Using Electronic Package Thermal
Information, states that thermal characterization parameters are
not the same as thermal resistances. ΨJB measures the component
power flowing through multiple thermal paths rather than through
a single path, as in thermal resistance (θJB). Therefore, ΨJB thermal
paths include convection from the top of the package as well as
radiation from the package, factors that make ΨJB more useful
in real-world applications. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and the power
dissipation (PD) using the formula
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP195 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient temperature
does not guarantee that TJ is within the specified temperature
limits. In applications with high power dissipation and poor
PCB thermal resistance, the maximum ambient temperature
may need to be derated.
TJ = TB + (PD × ΨJB)
See JESD51-8, JESD51-9, and JESD51-12 for more detailed
information about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Table 3. Thermal Resistance
Package Type
θJA
ΨJB
Unit
°C/W
°C/W
4-Ball, 0.5 mm Pitch WLCSP
6-Lead, 2 mm × 2 mm LFCSP
260
72.1
58.4
24.0
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
ESD CAUTION
TJ = TA + (PD × θJA)
Rev. C | Page 4 of 12
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