Datasheet > ADP1712AUJZ-0.9-R71

ADP1712AUJZ-0.9-R71

更新时间： 2022-04-25 03:32:37

品牌	Logo	应用领域
亚德诺 - ADI		稳压器
页数	文件大小	规格书
16页	491K
描述
300 mA, Low Dropout CMOS Linear Regulator

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ADP1712/ADP1713/ADP1714

140

120

100

THERMAL CONSIDERATIONS

MAX T_J(DO NOT OPERATE ABOVE THIS POINT)

To guarantee reliable operation, the junction temperature of the

ADP1712/ADP1713/ADP1714 must not exceed 125°C. To

ensure the junction temperature stays below this maximum value,

the user needs to be aware of the parameters that contribute to

junction temperature changes. These parameters include ambient

temperature, power dissipation in the power device, and thermal

resistances between the junction and ambient air (θ_JA). The θ_JA

number is dependent on the package assembly compounds used

and the amount of copper to which the GND pin of the package

is soldered on the PCB. Table 5 shows typical θ_JAvalues of the

5lead TSOT package for various PCB copper sizes.

1mA

10mA

30mA

80mA

100mA

300mA

200mA (LOAD CURRENT)

0.5

1.0

1.5

2.0

2.5

3.0 3.5 4.0 4.5

(V)

OUT

5.0

Table 5.

Copper Size (mm²)

0¹

100

300

500

– V

Figure 33. 500 mm²of PCB Copper, T_A= 25°C

θ_JA(°C/W)

170

152

146

134

131

140

120

100

MAX T_J(DO NOT OPERATE ABOVE THIS POINT)

¹Device soldered to minimum size pin traces.

The junction temperature of the ADP1712/ADP1713/ADP1714

can be calculated from the following equation:

T_J= T_A+ (P_D× θ_JA)

where:

(3)

1mA

10mA

30mA

80mA

100mA

300mA

T_Ais the ambient temperature.

P_Dis the power dissipation in the die, given by

200mA (LOAD CURRENT)

0.5

1.0

1.5

2.0

2.5

3.0 3.5 4.0 4.5

(V)

OUT

– V

P_D= [(V_IN– V_OUT) × I_LOAD] + (V_IN× I_GND

)

(4)

Figure 34. 100 mm²of PCB Copper, T_A= 25°C

where:

140

120

100

_LOADis the load current.

_GNDis the ground current.

MAX T_J(DO NOT OPERATE ABOVE THIS POINT)

_INand V_OUTare input voltage and output voltage, respectively.

Power dissipation due to ground current is quite small and can

be ignored. Therefore, the junction temperature equation

simplifies to the following:

T_J= T_A+ {[(V_IN– V_OUT) × I_LOAD] × θ_JA}

(5)

As shown in Equation 4, for a given ambient temperature, input-

to-output voltage differential, and continuous load current,

there exists a minimum copper size requirement for the PCB to

ensure the junction temperature does not rise above 125°C. The

following figures show junction temperature calculations for

different ambient temperatures, load currents, input-to-output

voltage differentials, and areas of PCB copper.

1mA

10mA

30mA

80mA

100mA

300mA

200mA (LOAD CURRENT)

0.5

1.0

1.5

2.0

2.5

3.0 3.5 4.0 4.5

(V)

OUT

– V

Figure 35. 0 mm²of PCB Copper, T_A= 25°C

Rev. A | Page 13 of 16

1...10 11 121314 15 16

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