Datasheet > ADP1655

ADP1655

更新时间： 2022-05-26 01:02:02

品牌	Logo	应用领域
亚德诺 - ADI		驱动器闪光灯
页数	文件大小	规格书
24页	664K
描述
Dual LED Flash Driver with I2C-Compatible Interface

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ADP1655 数据手册

ADP1655

ABSOLUTE MAXIMUM RATINGS

Table 4.

THERMAL RESISTANCE

θ_JAof the package is based on modeling and calculation using

a 4-layer board. θ_JAis highly dependent on the application and

board layout. In applications where high maximum power dissi-

pation exists, attention to thermal board design is required. The

value of θ_JAmay vary, depending on PCB material, layout, and

environmental conditions. The specified value of θ_JAis based

on a 4-layer, 4 in × 3 in, 2 1/2 oz copper board, per JEDEC

standards. For more information, see the AN-617 Application

Note, MicroCSP^TMWafer Level Chip Scale Package.

Parameter

Rating

VIN, SDA/EN2, SCL/EN1, I2C/EN,

STROBE, TORCH, TX_MASK to SGND

LED_OUT, SW, VOUT to SGND

PGND to SGND

VOUT to LED_OUT

Ambient Temperature Range (T_A)

Junction Temperature Range (T_J)

Storage Temperature

ESD Human Body Model

ESD Charged Device Model

ESD Machine Model

−0.3 V to +6 V

−0.3 V to +12 V

−0.3 V to +0.3 V

−0.3 V to +6 V

−40°C to +85°C

−40°C to +125°C

JEDEC J-STD-020

2000 V

θ_JAis specified for a device mounted on a JEDEC 2S2P PCB.

1000 V

200 V

Table 3. Thermal Resistance

Package Type

θ_JA

Unit

12-Ball WLCSP

°C/W

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

ESD CAUTION

THERMAL DATA

The ADP1655 may be damaged if the junction temperature

limits are exceeded. Monitoring T_Adoes not guarantee that T_J

is within the specified temperature limits. In applications with

high power dissipation and poor thermal resistance, the maximum

T_Amay have to be derated. In applications with moderate power

dissipation and low PCB thermal resistance, the maximum T_A

can exceed the maximum limit as long as the T_Jis within speci-

fication limits. T_Jof the device is dependent on the T_A, the power

dissipation (PD) of the device, and the junction-to-ambient

thermal resistance (θ_JA) of the package. Maximum T_Jis

calculated from the T_Aand PD using the following formula:

T_J= T_A+ (PD × θ_JA)

Rev. 0 | Page 6 of 24

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