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ADP150ACBZ-3.0-R7 PDF预览

ADP150ACBZ-3.0-R7

更新时间： 2024-01-04 11:05:55
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路输出元件PC
页数 文件大小 规格书
20页 556K
描述
Ultralow Noise, 150 mA CMOS Linear Regulator

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ADP150ACBZ-3.0-R7 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：0.80 X 0.80 MM, 0.40 MM PITCH, ROHS COMPLIANT, WLCSP-4针数：4
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.62
Samacsys Confidence：Samacsys Status：Released
Schematic Symbol：https://componentsearchengine.com/symbol.php?partID=421102PCB Footprint：https://componentsearchengine.com/footprint.php?partID=421102
Samacsys PartID：421102Samacsys Image：https://componentsearchengine.com/Images/9/ADP150ACBZ-3.0-R7.jpg
Samacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/1/ADP150ACBZ-3.0-R7.jpgSamacsys Pin Count：4
Samacsys Part Category：Integrated CircuitSamacsys Package Category：Other
Samacsys Footprint Name：BGA4C40P2X2_76X76X66Samacsys Released Date：2017-01-11 11:21:59
Is Samacsys：N可调性：FIXED
最大回动电压 1：0.16 V标称回动电压 1：0.105 V
最大绝对输入电压：6.5 V最大输入电压：5.5 V
最小输入电压：2.2 VJESD-30 代码：S-PBGA-B4
JESD-609代码：e1长度：0.76 mm
最大电网调整率：0.00315%最大负载调整率：0.027%
湿度敏感等级：1功能数量：1
输出次数：1端子数量：4
工作温度TJ-Max：125 °C工作温度TJ-Min：-40 °C
最大输出电流 1：0.15 A最大输出电压 1：3.045 V
最小输出电压 1：2.94 V标称输出电压 1：3 V
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA4,2X2,16封装形状：SQUARE
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：260认证状态：Not Qualified
调节器类型：FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR座面最大高度：0.66 mm
子类别：Other Regulators表面贴装：YES
技术：CMOS端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.4 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：30
宽度：0.76 mmBase Number Matches：1

ADP150ACBZ-3.0-R7 数据手册

 浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第11页浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第12页浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第13页浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第15页浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第16页浏览型号ADP150ACBZ-3.0-R7的Datasheet PDF文件第17页 
ADP150  
Power dissipation due to ground current is quite small and can be  
ignored. Therefore, the junction temperature equation simplifies to  
THERMAL CONSIDERATIONS  
In most applications, the ADP150 does not dissipate much heat  
due to its high efficiency. However, in applications with high  
ambient temperature and high supply voltage to output voltage  
differential, the heat dissipated in the package is large enough  
that it can cause the junction temperature of the die to exceed  
the maximum junction temperature of 125°C.  
TJ = TA + {[(VIN − VOUT) × ILOAD] × θJA}  
(3)  
As shown in the previous equation, for a given ambient temperature,  
input-to-output voltage differential, and continuous load current,  
there exists a minimum copper size requirement for the PCB to  
ensure that the junction temperature does not rise above 125°C.  
Figure 33 to Figure 46 show the junction temperature calculations  
for the different ambient temperatures, load currents, VIN-to-VOUT  
differentials, and areas of PCB copper.  
When the junction temperature exceeds 150°C, the converter  
enters thermal shutdown. It recovers only after the junction  
temperature decreases below 135°C to prevent any permanent  
damage. Therefore, thermal analysis for the chosen application is  
very important to guarantee reliable performance over all conditions.  
The junction temperature of the die is the sum of the ambient  
temperature of the environment and the temperature rise of the  
package due to the power dissipation, as shown in Equation 2.  
140  
MAX JUNCTION TEMPERATURE  
120  
I
I
I
I
I
I
I
= 1mA  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
= 10mA  
= 25mA  
= 50mA  
= 75mA  
= 100mA  
= 150mA  
100  
80  
To guarantee reliable operation, the junction temperature of  
the ADP150 must not exceed 125°C. To ensure that the junction  
temperature stays below 125°C, be aware of the parameters that  
contribute to the junction temperature changes. These parameters  
include ambient temperature, power dissipation in the power  
device, and thermal resistances between the junction and  
60  
40  
20  
ambient air (θ ). The θJA number is dependent on the package  
assembly compounds that are used and the amount of copper  
used to solder the package GND pins to the PCB. Table 7 shows  
JA  
0
0.5  
1.0  
1.5  
2.0  
2.5  
– V  
3.0  
(V)  
3.5  
4.0  
4.5  
V
IN  
OUT  
Figure 33. TSOT, 500 mm2 of PCB Copper, TA = 25°C  
typical θ values of the 5-lead TSOT and 4-ball WLCSP packages  
JA  
for various PCB copper sizes. Table 8 shows the typical ΨJB  
value of the 5-lead TSOT and 4-b a l l WLC SP.  
140  
120  
100  
80  
MAX JUNCTION TEMPERATURE  
Table 7. Typical θJA Values  
I
I
I
I
I
I
I
= 1mA  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
LOAD  
= 10mA  
= 25mA  
= 50mA  
= 75mA  
= 100mA  
= 150mA  
θJA (°C/W)  
Copper Size (mm2)  
01  
TSOT  
170  
152  
146  
134  
131  
WLCSP  
260  
159  
157  
153  
50  
100  
300  
500  
60  
40  
20  
151  
1 Device soldered to minimum size pin traces.  
Table 8. Typical ΨJB Values  
0
0.5  
1.0  
1.5  
2.0  
2.5  
– V  
3.0  
(V)  
3.5  
4.0  
4.5  
ΨJB (°C/W)  
V
IN  
OUT  
TSOT  
WLCSP  
Figure 34. TSOT, 100 mm2 of PCB Copper, TA = 25°C  
42.8  
58.4  
Use Equation 2 to calculate the junction temperature.  
TJ = TA + (PD × θJA)  
(2)  
where:  
TA is the ambient temperature.  
PD is the power dissipation in the die, given by  
PD = [(VIN − VOUT) × ILOAD] + (VIN × IGND  
where:  
)
I
LOAD is the load current.  
IGND is the ground current.  
VIN and VOUT are input and output voltages, respectively.  
Rev. A | Page 14 of 20  
 
 
 
 
 
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