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ADP123ACPZ-R7

更新时间： 2024-01-25 19:28:28
品牌 Logo 应用领域
亚德诺 - ADI 线性稳压器IC调节器电源电路光电二极管输出元件
页数 文件大小 规格书
24页 611K
描述
5.5 V Input, 300 mA, Low Quiescent Current, CMOS Linear Regulator

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ADP123ACPZ-R7 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：HVSON,针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.65
Is Samacsys：N最大回动电压 1：0.15 V
JESD-30 代码：S-PDSO-N6JESD-609代码：e4
长度：2 mm湿度敏感等级：1
功能数量：1端子数量：6
工作温度TJ-Max：125 °C工作温度TJ-Min：-40 °C
最大输出电流 1：0.3 A最大输出电压 1：5 V
最小输出电压 1：0.8 V封装主体材料：PLASTIC/EPOXY
封装代码：HVSON封装形状：SQUARE
封装形式：SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度（摄氏度）：260
调节器类型：ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR座面最大高度：0.65 mm
表面贴装：YES技术：CMOS
端子面层：NICKEL PALLADIUM GOLD端子形式：NO LEAD
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：40宽度：2 mm
Base Number Matches：1

ADP123ACPZ-R7 数据手册

 浏览型号ADP123ACPZ-R7的Datasheet PDF文件第2页浏览型号ADP123ACPZ-R7的Datasheet PDF文件第3页浏览型号ADP123ACPZ-R7的Datasheet PDF文件第4页浏览型号ADP123ACPZ-R7的Datasheet PDF文件第6页浏览型号ADP123ACPZ-R7的Datasheet PDF文件第7页浏览型号ADP123ACPZ-R7的Datasheet PDF文件第8页 
Data Sheet  
ADP122/ADP123  
ABSOLUTE MAXIMUM RATINGS  
application and board layout. In applications in which high maxi-  
mum power dissipation exists, close attention to thermal board  
design is required. The value of θJA may vary, depending on PCB  
material, layout, and environmental conditions. The specified  
values of θJA are based on a 4-layer, 4 inch × 3 inch circuit board.  
Refer to JESD51-7 for detailed information on the board  
construction  
Table 3.  
Parameter  
Rating  
VIN to GND  
ADJ to GND  
EN to GND  
VOUT to GND  
−0.3 V to +6.5 V  
−0.3 V to +6.5 V  
−0.3 V to +6.5 V  
−0.3 V to VIN  
Storage Temperature Range  
Operating Ambient Temperature Range  
Operating Junction Temperature  
Soldering Conditions  
−65°C to +150°C  
−40°C to +125°C  
−40°C to +125°C  
JEDEC J-STD-020  
ΨJB is the junction-to-board thermal characterization parameter  
and is measured in °C /W. The ΨJB of the package is based on  
modeling and calculation using a 4-layer board. The Guidelines for  
Reporting and Using Package Thermal Information: JESD51-12  
states that thermal characterization parameters are not the same  
as thermal resistances. ΨJB measures the component power flowing  
through multiple thermal paths rather than a single path as in  
thermal resistance, θJB. Therefore, ΨJB thermal paths include  
convection from the top of the package as well as radiation from  
the package—factors that make ΨJB more useful in real-world  
applications. Maximum junction temperature (TJ) is calculated  
from the board temperature (TB) and power dissipation (PD)  
using the formula  
Stresses above those listed under Absolute Maximum Ratings may  
cause permanent damage to the device. This is a stress rating  
only; functional operation of the device at these or any other  
conditions above those indicated in the operational section of  
this specification is not implied. Exposure to absolute maximum  
rating conditions for extended periods may affect device reliability.  
THERMAL DATA  
Absolute maximum ratings apply individually only, not in  
combination. The ADP122/ADP123 can be damaged when the  
junction temperature limits are exceeded. Monitoring ambient  
temperature does not guarantee that TJ will remain within the  
specified temperature limits. In applications with high power  
dissipation and poor thermal resistance, the maximum ambient  
temperature may have to be derated.  
TJ = TB + (PD × ΨJB)  
Refer to JESD51-8 and JESD51-12 for more detailed information  
about ΨJB.  
THERMAL RESISTANCE  
θJA and ΨJB are specified for the worst-case conditions, that is, a  
device soldered in a circuit board for surface-mount packages.  
In applications with moderate power dissipation and low PCB  
thermal resistance, the maximum ambient temperature can  
exceed the maximum limit as long as the junction temperature  
is within specification limits. The junction temperature (TJ) of  
the device is dependent on the ambient temperature (TA), the  
power dissipation of the device (PD), and the junction-to-ambient  
thermal resistance of the package (θJA).  
Table 4. Thermal Resistance  
Package Type  
θJA  
ΨJB  
43  
44.1  
Unit  
°C/W  
°C/W  
5-Lead TSOT  
6-Lead 2 mm × 2 mm LFCSP  
170  
68.9  
ESD CAUTION  
Maximum junction temperature (TJ) is calculated from the  
ambient temperature (TA) and power dissipation (PD) using the  
formula  
TJ = TA + (PD × θJA)  
The junction-to-ambient thermal resistance (θJA) of the package  
is based on modeling and calculation using a 4-layer board. The  
junction-to-ambient thermal resistance is highly dependent on the  
Rev. E | Page 5 of 24  
 
 
 
 
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