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ADN2872ACPZ-RL PDF预览

ADN2872ACPZ-RL

更新时间: 2024-01-01 20:05:52
品牌 Logo 应用领域
亚德诺 - ADI 驱动器驱动程序和接口二极管激光二极管接口集成电路PC
页数 文件大小 规格书
20页 582K
描述
3.3 V Dual-Loop, 50 Mbps to 3.3 Gbps Laser Diode Driver

ADN2872ACPZ-RL 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:QFN
包装说明:4 X 4 MM, ROHS COMPLIANT, MO220VGGD-2, LFCSP-24针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.13
Samacsys Confidence:Samacsys Status:Released
Schematic Symbol:https://componentsearchengine.com/symbol.php?partID=579200PCB Footprint:https://componentsearchengine.com/footprint.php?partID=579200
Samacsys PartID:579200Samacsys Image:https://componentsearchengine.com/Images/9/ADN2872ACPZ-RL.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/1/ADN2872ACPZ-RL.jpgSamacsys Pin Count:25
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Other
Samacsys Footprint Name:QFN50P400X400X100-25NSamacsys Released Date:2017-01-11 11:21:59
Is Samacsys:N接口集成电路类型:INTERFACE CIRCUIT
JESD-30 代码:S-XQCC-N24JESD-609代码:e3
长度:4 mm湿度敏感等级:1
功能数量:1端子数量:24
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装等效代码:LCC24,.16SQ,20封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):225
电源:3.3 V认证状态:Not Qualified
座面最大高度:1 mm子类别:Display Drivers
最大供电电压:3.6 V最小供电电压:3 V
标称供电电压:3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4 mmBase Number Matches:1

ADN2872ACPZ-RL 数据手册

 浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第2页浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第3页浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第4页浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第6页浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第7页浏览型号ADN2872ACPZ-RL的Datasheet PDF文件第8页 
ADN2872  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Table 3.  
Parameter  
Rating  
VCC to GND  
IMODN, IMODP  
PAVCAP, ERCAP, PAVSET, PAVREF, ERREF,  
IBIAS, IBMON, IMMON, ALS, CCBIAS, RPAV,  
ERSET, FAIL  
4. 2 V  
−0.3 V to +4.8 V  
−0.3 V to +3.9 V  
DATAP, DATAN (Single-Ended Differential)  
Junction Temperature (TJ max)  
Operating Temperature Range, Industrial  
Storage Temperature Range  
Power Dissipation (W)1  
1.5 V  
125°C  
−40°C to +85°C  
−65°C to +150°C  
(TJ max − TA)/θJA  
48.6°C/W  
ESD CAUTION  
θJA Thermal Impedance2  
θJC Thermal Impedance2  
θJB Thermal Impedance2  
5.0°C/W  
28.4°C/W  
1 Power consumption equations are provided in the Power Consumption  
section.  
2 θJA, θJB, and θJC are estimated when the part’s exposed pad is soldered on a  
4-layer JEDEC board at zero airflow.  
Rev. 0 | Page 5 of 20  
 
 

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