Datasheet > 射频和微波 > 射频/微波放大器> ADL5531ACPZ-WP

ADL5531ACPZ-WP

更新时间： 2024-01-03 00:30:13

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
12页	321K
描述
RF/Microwave Amplifier, 20 MHz - 500 MHz RF/MICROWAVE NARROW BAND MEDIUM POWER AMPLIFIER, 3 X 3 MM, LEAD FREE, LFCSP, 8 PIN

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ADL5531ACPZ-WP 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.33.00.01
风险等级：	5.71	Is Samacsys：	N
特性阻抗：	50 Ω	构造：	COMPONENT
增益：	19.7 dB	最大输入功率 (CW)：	12 dBm
JESD-609代码：	e3	最大工作频率：	500 MHz
最小工作频率：	20 MHz	最高工作温度：	85 °C
最低工作温度：	-40 °C	射频/微波设备类型：	NARROW BAND MEDIUM POWER
端子面层：	Matte Tin (Sn)	Base Number Matches：	1

ADL5531ACPZ-WP 数据手册

ADL5531

BASIC CONNECTIONS

2.03mm

The basic connections for operating the ADL5531 are shown

in Figure 15. The input and output are ac-coupled with 10 nF

(0402) capacitors. DC bias is provided to the amplifier via an

inductor (Coilcraft 1008CS-471XJLC or equivalent) connected

to the RFOUT pin. The bias voltage should be decoupled using

10 nF and 1 μF capacitors.

SOLDERING INFORMATION AND RECOMMENDED

PCB LAND PATTERN

1.53mm

0.71mm

Figure 14 shows the recommended land pattern for ADL5531.

To minimize thermal impedance, the exposed paddle on the

package underside is soldered down to a ground plane. If

multiple ground layers exist, they are stitched together using

vias (a minimum of five vias is recommended). Pin 1, Pin 3,

Pin 4, Pin 6 and Pin 8 can be left unconnected or can be

connected to ground. Connecting these pins to ground slightly

enhances thermal impedance. For more information on land

pattern design and layout, refer to Application Note AN-772, A

Design and Manufacturing Guide for the Lead Frame Chip Scale

Package (LFCSP).

Figure 14. Recommended Land Pattern

VPOS

(TESTLOOP RED)

10nF

1µF

470nH

GND

(TESTLOOP BLACK)

ADL5531

1 NC

RFIN

RFOUT

2 RFIN

3 NC

RFOUT

10nF

4 NC

CLIN 5

1nF

NC = NO CONNECT

Figure 15. Basic Connections

Rev. 0 | Page 9 of 12

1...6 7 8910 11 12

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