是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA20,4X5,20 | 针数: | 20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.13 |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | R-PBGA-B20 |
JESD-609代码: | e1 | 长度: | 2.5 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | VFBGA | 封装等效代码: | BGA20,4X5,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.2/5,1.8/5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.65 mm |
子类别: | Other Interface ICs | 最大供电电压: | 5.5 V |
最小供电电压: | 1.15 V | 标称供电电压: | 1.8 V |
电源电压1-最大: | 5.5 V | 电源电压1-分钟: | 1.65 V |
表面贴装: | YES | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 2 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
ADG3308BCBZ-1-RL7 | ADI | Low Voltage, 1.15 V to 5.5 V, 8-Channel Bidirectional Logic Level Translators |
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ADG3308BCBZ-2-REEL | ADI | Low Voltage, 1.15 V to 5.5 V, 8-Channel Bidirectional Logic Level Translators |
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ADG3308BCBZ-2-RL7 | ADI | Low Voltage, 1.15 V to 5.5 V, 8-Channel Bidirectional Logic Level Translators |
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ADG3308BCP | ADI | Low Voltage 1.2 V to 5.5 V, Bidirectional, Logic Level Translators |
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ADG3308BCPZ-REEL | ADI | Low Voltage, 1.15 V to 5.5 V, 8-Channel Bidirectional Logic Level Translators |
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ADG3308BCPZ-REEL7 | ADI | Low Voltage, 1.15 V to 5.5 V, 8-Channel Bidirectional Logic Level Translators |
获取价格 |