ADF7021-N
OUTLINE DIMENSIONS
0.30
0.23
0.18
7.00
BSC SQ
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
37
36
48
1
PIN 1
INDICATOR
EXPOSED
PAD
(BOTTOM VIEW)
4.25
4.10 SQ
3.95
TOP
VIEW
6.75
BSC SQ
0.50
0.40
0.30
25
24
12
13
0.25 MIN
5.50
REF
0.80 MAX
0.65 TYP
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.50 BSC
0.20 REF
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2
Figure 79. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
7 mm × 7 mm Body, Very Thin Quad
(CP-48-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
Package Option
CP-48-3
CP-48-3
ADF7021-NBCPZ1
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Die on Film
ADF7021-NBCPZ-RL1
ADF7021-NBCPZ-RL71
ADF7021-NDF
CP-48-3
EVAL-ADF70XXMBZ21
EVAL-ADF7021-NDBIZ1
EVAL-ADF7021-NDBEZ1
EVAL-ADF7021-NDBZ21
EVAL-ADF7021-NDBZ51
Evaluation Platform Mother Board
426 MHz to 429 MHz Daughter Board
426 MHz to 429 MHz Daughter Board
860 MHz to 870 MHz Daughter Board
Matching Unpopulated Daughter Board
1 Z = RoHS Compliant Part.
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07246-0-2/08(0)
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