ADF41513
Data Sheet
OUTLINE DIMENSIONS
DETAIL A
(JEDEC 95)
4.10
4.00 SQ
3.90
0.30
0.25
0.18
PIN 1
INDICATOR
AREA
PIN 1
IONS
INDICATOR AR EA OP T
(SEE DETAIL A)
24
19
18
1
0.50
BSC
2.85
2.70 SQ
2.45
EXPOSED
PAD
13
12
6
7
0.50
0.40
0.30
0.20 MIN
TOP VIEW
SIDE VIEW
BOTTOM VIEW
0.80
0.75
0.70
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8
Figure 38. 24-Lead Lead Frame Chip Scale Package [LFCSP]
4 mm × 4 mm Body and 0.75 mm Package Height
(CP-24-8)
Dimensions shown in millimeters
ORDERING GUIDE
Parameter1
Temperature Range
−40°C to +105°C
−40°C to +105°C
Package Description
Package Option
CP-24-8
CP-24-8
ADF41513BCPZ
24-Lead Lead Frame Chip Scale Package [LFCSP]
24-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board Without VCO
ADF41513BCPZ-RL7
EV-ADF41513SD1Z
EV-ADF41513SD2Z
Evaluation Board with On-Board VCO
1 Z = RoHS Compliant Part.
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D16805-0-1/19(0)
Rev. 0 | Page 30 of 30