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ADCLK954/PCBZ PDF预览

ADCLK954/PCBZ

更新时间: 2024-01-01 21:54:59
品牌 Logo 应用领域
亚德诺 - ADI 半导体时钟
页数 文件大小 规格书
12页 294K
描述
Two Selectable Inputs, 12 LVPECL Outputs, SiGe Clock Fanout Buffer

ADCLK954/PCBZ 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:40
Reach Compliance Code:unknown风险等级:5.75
Is Samacsys:N系列:954
输入调节:DIFFERENTIALJESD-30 代码:S-XQCC-N40
JESD-609代码:e3长度:6 mm
逻辑集成电路类型:LOW SKEW CLOCK DRIVER湿度敏感等级:NOT APPLICABLE
功能数量:1反相输出次数:
端子数量:40实输出次数:12
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER
峰值回流温度(摄氏度):260传播延迟(tpd):0.21 ns
认证状态:COMMERCIAL座面最大高度:1 mm
最大供电电压 (Vsup):3.63 V最小供电电压 (Vsup):2.97 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:6 mm最小 fmax:4500 MHz
Base Number Matches:1

ADCLK954/PCBZ 数据手册

 浏览型号ADCLK954/PCBZ的Datasheet PDF文件第2页浏览型号ADCLK954/PCBZ的Datasheet PDF文件第3页浏览型号ADCLK954/PCBZ的Datasheet PDF文件第4页浏览型号ADCLK954/PCBZ的Datasheet PDF文件第6页浏览型号ADCLK954/PCBZ的Datasheet PDF文件第7页浏览型号ADCLK954/PCBZ的Datasheet PDF文件第8页 
ADCLK954  
ABSOLUTE MAXIMUM RATINGS  
Table 5.  
DETERMINING JUNCTION TEMPERATURE  
To determine the junction temperature on the application  
printed circuit board (PCB), use the following equation:  
Parameter  
Supply Voltage  
VCC − VEE  
Rating  
6.0 V  
TJ = TCASE + (ΨJT × PD)  
Input Voltage  
where:  
CLK0, CLK1,  
,
, IN_SEL  
VEE − 0.5 V to  
VCC + 0.5 V  
40 mA  
CLK0 CLK1  
TJ is the junction temperature (°C).  
TCASE is the case temperature (°C) measured by the customer at  
CLK0, CLK1,  
,
to V x Pin (CML,  
CLK0 CLK1  
T
the top center of the package.  
ΨJT is from Table 6.  
PD is the power dissipation.  
LVPECL Termination)  
CLK0, CLK1 to  
,
1.8 V  
2 V  
CLK0 CLK1  
Input Termination, V x to CLK0, CLK1,  
,
CLK0  
T
and  
CLK1  
Values of θJA are provided for package comparison and PCB  
design considerations. θJA can be used for a first-order approxi-  
mation of TJ by the equation  
Maximum Voltage on Output Pins  
Maximum Output Current  
Voltage Reference (VREFx)  
Operating Temperature Range  
Ambient  
VCC + 0.5 V  
35 mA  
VCC to VEE  
TJ = TA + (θJA × PD)  
where TA is the ambient temperature (°C).  
−40°C to +85°C  
150°C  
Values of θJB are provided in Table 6 for package comparison  
Junction  
and PCB design considerations.  
Storage Temperature Range  
−65°C to +150°C  
ESD CAUTION  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
THERMAL PERFORMANCE  
Table 6.  
Parameter  
Symbol  
Description  
Value1  
Unit  
Junction-to-Ambient Thermal Resistance  
Still Air  
0.0 m/sec Air Flow  
Moving Air  
θJA  
Per JEDEC JESD51-2  
Per JEDEC JESD51-6  
46.1  
°C/W  
θJMA  
1.0 m/sec Air Flow  
2.5 m/sec Air Flow  
40.3  
36.2  
°C/W  
°C/W  
Junction-to-Board Thermal Resistance  
Moving Air  
θJB  
Per JEDEC JESD51-8  
1.0 m/sec Air Flow  
Junction-to-Case Thermal Resistance  
Moving Air  
Die-to-Heatsink  
Junction-to-Top-of-Package Characterization Parameter  
Still Air  
28.ꢀ  
8.3  
°C/W  
°C/W  
°C/W  
θJC  
Per MIL-STD 883, Method 1012.1  
Per JEDEC JESD51-2  
ΨJT  
0 m/sec Air Flow  
0.6  
1 Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the  
application to determine if they are similar to those assumed in these calculations.  
Rev. A | Page 5 of 12  
 
 
 

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