Datasheet > ADAU1452WBCPZ-RL

ADAU1452WBCPZ-RL

更新时间： 2024-01-06 15:06:28

品牌	Logo	应用领域
亚德诺 - ADI		商用集成电路
页数	文件大小	规格书
180页	9219K
描述
SigmaDSP Digital Audio Processor

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技术参数
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ADAU1452WBCPZ-RL 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	HVQCCN,
针数：	72	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.31.00.01
风险等级：	1.55	商用集成电路类型：	CONSUMER CIRCUIT
JESD-30 代码：	S-XQCC-N72	JESD-609代码：	e3
长度：	10 mm	湿度敏感等级：	3
功能数量：	1	端子数量：	72
最高工作温度：	105 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	HVQCCN
封装形状：	SQUARE	封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260	座面最大高度：	1 mm
最大供电电压 (Vsup)：	3.63 V	最小供电电压 (Vsup)：	2.97 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子面层：	Tin (Sn)	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	30	宽度：	10 mm
Base Number Matches：	1

ADAU1452WBCPZ-RL 数据手册

浏览型号ADAU1452WBCPZ-RL的Datasheet PDF文件第173页

浏览型号ADAU1452WBCPZ-RL的Datasheet PDF文件第174页

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浏览型号ADAU1452WBCPZ-RL的Datasheet PDF文件第179页

ADAU1452/ADAU1451/ADAU1450

Data Sheet

APPLICATIONS INFORMATION

Parts Placement

PCB DESIGN CONSIDERATIONS

Place all 100 nF bypass capacitors, which are recommended for

every analog, digital, and PLL power ground pair, as near as

possible to the ADAU1452/ADAU1451/ADAU1450. Bypass each

of the AVDD, DVDD, PVDD, and IOVDD supply signals on the

board with an additional single bulk capacitor (10 μF to 47 μF).

A solid ground plane is a necessity for maintaining signal integrity

and minimizing EMI radiation. If the PCB has two ground planes,

they can be stitched together using vias that are spread evenly

throughout the board.

Power Supply Bypass Capacitors

Keep all traces in the crystal resonator circuit (see Figure 15) as

short as possible to minimize stray capacitance. Do not connect

any long board traces to the crystal oscillator circuit components

because such traces may affect crystal startup and operation.

Bypass each power supply pin to its nearest appropriate ground

pin with a single 100 nF capacitor and, optionally, with an addi-

tional 10 nF capacitor in parallel. Make the connections to each

side of the capacitor as short as possible, and keep the trace on

a single layer with no vias. For maximum effectiveness, place the

capacitor either equidistant from the power and ground pins or,

when equidistant placement is not possible, slightly nearer to

the power pin (see Figure 81). Establish the thermal connections

to the planes on the far side of the capacitor.

Grounding

Use a single ground plane in the application layout. Place all

components in an analog signal path away from digital signals.

Exposed Pad PCB Design

The device package includes an exposed pad for improved heat

dissipation. When designing a board for such a package, give

special consideration to the following:

POWER GROUND

•

Place a copper layer, equal in size to the exposed pad, on all

layers of the board, from top to bottom. Connect the copper

layers to a dedicated copper board layer (see Figure 84).

CAPACITOR

TO POWER

TOP

GROUND

POWER

BOTTOM

TO GROUND

VIAS

COPPER SQUARES

Figure 81. Recommended Power Supply Bypass Capacitor Layout

Figure 84. Exposed Pad Layout Example—Side View

Typically, a single 100 nF capacitor for each power ground pin

pair is sufficient. However, if there is excessive high frequency

noise in the system, use an additional 10 nF capacitor in parallel

(see Figure 82). In that case, place the 10 nF capacitor between

the devices and the 100 nF capacitor, and establish the thermal

connections on the far side of the 100 nF capacitor.

•

Place vias such that all layers of copper are connected,

allowing for efficient heat and energy conductivity. For an

example, see Figure 85, which shows 49 vias arranged in

a 7 × 7 grid in the pad area.

VIA TO

POWER PLANE

VIA TO

GROUND PLANE

100nF

10nF

Figure 85. Exposed Pad Layout Example—Top View

PLL Filter

Figure 82. Layout for Multiple Power Supply Bypass Capacitors

To minimize jitter, connect the single resistor and two capacitors

in the PLL filter to the PLLFILT and PVDD pins with short traces.

To provide a current reservoir in case of sudden current spikes,

use a 10 µF capacitor for each named supply (DVDD, AVDD,

PVDD, and IOVDD) as shown in Figure 83.

BULK BYPASS CAPACITORS

3.3V

AVDD PVDD IOVDD DVDD

10µF

Figure 83. Bulk Capacitor Schematic

Rev. C | Page 176 of 180

1...173 174 175176177 178 179 180

中文翻译

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ADAU1452WBCPZ-RL 替代型号

型号	品牌	替代类型	描述	数据表
ADAU1452WBCPZ	ADI	类似代替	SigmaDSP Digital Audio Processor

与ADAU1452WBCPZ-RL相关器件

型号	品牌	获取价格	描述	数据表
ADAU1461	ADI	获取价格	SigmaDSP Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL
ADAU1461WBCPZ	ADI	获取价格	SigmaDSP Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL
ADAU1461WBCPZ-R7	ADI	获取价格	SigmaDSP Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL
ADAU1461WBCPZ-RL	ADI	获取价格	SigmaDSP Stereo, Low Power, 96 kHz, 24-Bit Audio Codec with Integrated PLL
ADAU1462	ADI	获取价格	SigmaDSP Digital Audio Processor
ADAU1462WBCPZ150	ADI	获取价格	SigmaDSP Digital Audio Processor
ADAU1462WBCPZ150RL	ADI	获取价格	SigmaDSP Digital Audio Processor
ADAU1462WBCPZ300	ADI	获取价格	SigmaDSP Compact Digital Audio Processor
ADAU1462WBCPZ300RL	ADI	获取价格	SigmaDSP Digital Audio Processor
ADAU1463	ADI	获取价格	SigmaDSP Digital Audio Processor

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