ADA4932-1/ADA4932-2
OUTLINE DIMENSIONS
0.50
0.40
0.30
3.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
*
1.45
1.30 SQ
1.15
13
16
1
0.45
(BOTTOM VIEW)
12
PIN 1
INDICATOR
2.75
BSC SQ
TOP
VIEW
EXPOSED
PAD
4
9
0.50
BSC
8
5
0.25 MIN
1.50 REF
0.80 MAX
12° MAX
0.65 TYP
1.00
0.85
0.80
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.05 MAX
0.02 NOM
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.30
0.23
0.18
0.20 REF
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
EXCEPT FOR EXPOSED PAD DIMENSION.
Figure 68. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
3 mm × 3 mm Body, Very Thin Quad (CP-16-2)
Dimensions shown in millimeters
0.60 MAX
4.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
1
24
19
18
PIN 1
INDICATOR
0.50
BSC
2.25
TOP
VIEW
3.75
BSC SQ
EXPOSED
2.10 SQ
1.95
PAD
(BOTTOM VIEW)
0.50
0.40
0.30
6
13
12
7
0.25 MIN
0.80 MAX
0.65TYP
2.50 REF
1.00
0.85
0.80
12° MAX
0.05 MAX
0.02 NOM
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.30
0.23
0.18
0.20 REF
SECTION OF THIS DATA SHEET.
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2
Figure 69. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad (CP-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Package Description
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
24-Lead LFCSP_VQ
Package Option
CP-16-2
CP-16-2
Ordering Quantity
Branding
H1K
H1K
ADA4932-1YCPZ-R21
ADA4932-1YCPZ-RL1
ADA4932-1YCPZ-R71
ADA4932-2YCPZ-R21
ADA4932-2YCPZ-RL1
ADA4932-2YCPZ-R71
250
5,000
1,500
250
5,000
1,500
CP-16-2
H1K
CP-24-1
CP-24-1
CP-24-1
1 Z = RoHS Compliant Part.
Rev. A | Page 26 of 28