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ADA4927-1 PDF预览

ADA4927-1

更新时间: 2024-01-17 14:57:23
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
24页 840K
描述
Ultralow Distortion Current Feedback Differential ADC Driver

ADA4927-1 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.41
Is Samacsys:N差分输出:YES
驱动器位数:1输入特性:DIFFERENTIAL
接口集成电路类型:LINE DRIVER接口标准:GENERAL PURPOSE
JESD-30 代码:S-XQCC-N16JESD-609代码:e3
长度:3 mm湿度敏感等级:3
功能数量:1端子数量:16
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装代码:HVQCCN
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大接收延迟:座面最大高度:1 mm
最大供电电压:11 V最小供电电压:4.5 V
表面贴装:YES技术:BIPOLAR
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:3 mmBase Number Matches:1

ADA4927-1 数据手册

 浏览型号ADA4927-1的Datasheet PDF文件第18页浏览型号ADA4927-1的Datasheet PDF文件第19页浏览型号ADA4927-1的Datasheet PDF文件第20页浏览型号ADA4927-1的Datasheet PDF文件第21页浏览型号ADA4927-1的Datasheet PDF文件第22页浏览型号ADA4927-1的Datasheet PDF文件第23页 
ADA4927-1/ADA4927-2  
OUTLINE DIMENSIONS  
0.50  
0.40  
0.30  
3.00  
BSC SQ  
0.60 MAX  
PIN 1  
INDICATOR  
*
1.45  
1.30 SQ  
1.15  
13  
16  
1
0.45  
(BOTTOM VIEW)  
12  
PIN 1  
INDICATOR  
2.75  
BSC SQ  
TOP  
VIEW  
EXPOSED  
PAD  
4
9
0.50  
BSC  
8
5
0.25 MIN  
1.50 REF  
0.80 MAX  
12° MAX  
0.65 TYP  
1.00  
0.85  
0.80  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.05 MAX  
0.02 NOM  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
0.30  
0.23  
0.18  
0.20 REF  
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2  
EXCEPT FOR EXPOSED PAD DIMENSION.  
Figure 59. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
3 mm × 3 mm Body, Very Thin Quad (CP-16-2)  
Dimensions shown in millimeters  
0.60 MAX  
4.00  
BSC SQ  
0.60 MAX  
PIN 1  
INDICATOR  
1
24  
19  
18  
PIN 1  
INDICATOR  
0.50  
BSC  
2.25  
TOP  
VIEW  
3.75  
BSC SQ  
EXPOSED  
2.10 SQ  
1.95  
PAD  
(BOTTOM VIEW)  
0.50  
0.40  
0.30  
6
13  
12  
7
0.25 MIN  
0.80 MAX  
0.65TYP  
2.50 REF  
1.00  
0.85  
0.80  
12° MAX  
0.05 MAX  
0.02 NOM  
COPLANARITY  
0.08  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
0.30  
0.23  
0.18  
0.20 REF  
SECTION OF THIS DATA SHEET.  
SEATING  
PLANE  
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2  
Figure 60. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
4 mm × 4 mm Body, Very Thin Quad (CP-24-1)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Model  
Temperature Range  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
−40°C to +105°C  
Package Description  
16-Lead LFCSP_VQ  
16-Lead LFCSP_VQ  
16-Lead LFCSP_VQ  
24-Lead LFCSP_VQ  
24-Lead LFCSP_VQ  
24-Lead LFCSP_VQ  
Package Option  
CP-16-2  
CP-16-2  
Ordering Quantity  
Branding  
H1M  
H1M  
ADA4927-1YCPZ-R21  
ADA4927-1YCPZ-RL1  
ADA4927-1YCPZ-R71  
ADA4927-2YCPZ-R21  
ADA4927-2YCPZ-RL1  
ADA4927-2YCPZ-R71  
250  
5,000  
1,500  
250  
5,000  
1,500  
CP-16-2  
H1M  
CP-24-1  
CP-24-1  
CP-24-1  
1 Z = RoHS Compliant Part.  
©2008 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D07574-0-10/08(0)  
Rev. 0 | Page 24 of 24  
 
 
 

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