Datasheet > ADA4805-2ARMZ-R7

ADA4805-2ARMZ-R7

更新时间： 2024-01-29 09:14:39

品牌	Logo	应用领域
亚德诺 - ADI		放大器光电二极管
页数	文件大小	规格书
25页	830K
描述
Dual, 0.2 µV/°C Offset Drift, 105 MHz Low Power, Low Noise, Rail-to-Rail Amplifier

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ADA4805-2ARMZ-R7 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	SOIC
包装说明：	TSSOP,	针数：	8
Reach Compliance Code：	compliant	风险等级：	1.71
放大器类型：	OPERATIONAL AMPLIFIER	最大平均偏置电流 (IIB)：	0.8 µA
标称共模抑制比：	130 dB	最大输入失调电压：	125 µV
JESD-30 代码：	S-PDSO-G8	JESD-609代码：	e3
长度：	3 mm	湿度敏感等级：	1
负供电电压上限：	-5.5 V	标称负供电电压 (Vsup)：	-5 V
功能数量：	2	端子数量：	8
最高工作温度：	125 °C	最低工作温度：	-40 °C
封装主体材料：	PLASTIC/EPOXY	封装代码：	TSSOP
封装形状：	SQUARE	封装形式：	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度（摄氏度）：	260	座面最大高度：	1.1 mm
标称压摆率：	250 V/us	子类别：	Operational Amplifier
供电电压上限：	5.5 V	标称供电电压 (Vsup)：	5 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	AUTOMOTIVE	端子面层：	Matte Tin (Sn)
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	DUAL	处于峰值回流温度下的最长时间：	30
宽度：	3 mm	Base Number Matches：	1

ADA4805-2ARMZ-R7 数据手册

Data Sheet

ADA4805-1/ADA4805-2

ABSOLUTE MAXIMUM RATINGS

The quiescent power dissipation is the voltage between the supply

pins (V_S) multiplied by the quiescent current (I_S).

Table 5.

Parameter

Rating

P_D= Quiescent Power + (Total Drive Power − Load Power)

Supply Voltage

11 V

Power Dissipation

See Figure 3

−V_S− 0.7 V to +V_S+ 0.7 V

1 V

−65°C to +125°C

−40°C to +125°C













V_SV_OUT

V_OUT

R_L

Common-Mode Input Voltage

Differential Input Voltage

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering, 10 sec) 300°C

Junction Temperature 150°C





P_D V_S I_S







R_L

RMS output voltages must be considered. If R_Lis referenced

to −V_S, as in single-supply operation, the total drive power is

V_S× I_OUT. If the rms signal levels are indeterminate, consider the

worst case, when V_OUT= V_S/4 for R_Lto midsupply.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.



V_S/ 4



P_D



V_S I_S



R_L

In single-supply operation with R_Lreferenced to −V_S, worst case

is V_OUT= V_S/2.

Airflow increases heat dissipation, effectively reducing θ_JA. Also,

more metal directly in contact with the package leads and

exposed pad from metal traces, through holes, ground, and

power planes reduces θ_JA.

THERMAL RESISTANCE

θ_JAis specified for the worst case conditions, that is, θ_JAis specified

for a device soldered in a circuit board for surface-mount packages.

Table 6 lists the θ_JAfor the ADA4805-1/ADA4805-2.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature on a JEDEC standard,

4-layer board. θ_JAvalues are approximations.

4.0

Table 6. Thermal Resistance

= 150°C

Package Type

θ_JA

Unit

°C/W

3.5

3.0

2.5

2.0

1.5

1.0

0.5

6-Lead SC70

223.6

209.1

123.8

51.4

10-LEAD LFCSP

6-Lead SOT-23

8-Lead MSOP

10-Lead LFCSP

MAXIMUM POWER DISSIPATION

8-LEAD MSOP

6-LEAD SOT-23

The maximum safe power dissipation for the ADA4805-1/

ADA4805-2 is limited by the associated rise in junction

temperature (T_J) on the die. At approximately 150C, which is

the glass transition temperature, the properties of the plastic

change. Even temporarily exceeding this temperature limit may

change the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4805-1/ADA4805-2.

Exceeding a junction temperature of 175C for an extended

period of time can result in changes in silicon devices, potentially

causing degradation or loss of functionality.

6-LEAD SC70

–50

–30

–10

110

130

AMBIENT TEMPERATURE (°C)

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

The power dissipated in the package (P_D) is the sum of the

quiescent power dissipation and the power dissipated in the die

due to the ADA4805-1/ADA4805-2 output load drive.

Rev. B | Page 7 of 25

1...4 5 678 9 10...25

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