ADA4610-1/ADA4610-2/ADA4610-4
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 4.
Parameter
Rating
Table 5. Thermal Resistance
Package Type
5-Lead SOT-23
8-Lead SOIC
8-Lead LFCSP
8-Lead MSOP
Supply Voltage
Input Voltage
Input Current1
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 10 sec)
Electrostatic Discharge (Human Body Model)2
Field Induced Charge Device Model (FICDM)3
18 V
VS
10 mA
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
2500 V
1250 V
1
θJA
θJC
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
219.4
120
57
142
115
65
155.6
43
12
45
36
14-Lead SOIC
16-Lead LFCSP
3.2
1 θJA is specified for worst-case conditions, that is, θJA is specified for a device
soldered in a circuit board for surface-mount packages.
1 The input pins have clamp diodes connected to the power supply pins. Limit
the input current to 10 mA or less whenever input signals exceed the power
supply rail by 0.3 V.
ESD CAUTION
2 ESDA/JEDEC JS-001-2011 applicable standard.
3 JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. G | Page 6 of 25