Datasheet > ADA4304-2ACPZ-R2

ADA4304-2ACPZ-R2

更新时间： 2024-02-29 16:58:02

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
12页	398K
描述
1:2 Single-Ended, Low Cost, Active RF Splitter

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ADA4304-2ACPZ-R2 技术参数

是否无铅：	含铅	是否Rohs认证：	符合
生命周期：	Obsolete	包装说明：	LCC16,.12SQ,20
针数：	16	Reach Compliance Code：	compliant
ECCN代码：	EAR99	HTS代码：	8542.39.00.01
风险等级：	5.1	Base Number Matches：	1

ADA4304-2ACPZ-R2 数据手册

ADA4304-2

ABSOLUTE MAXIMUM RATINGS

The power dissipated in the package (P_D) is essentially equal to

the quiescent power dissipation; the supply voltage (V_S) times

the quiescent current (I_S). In Table 1, the maximum power

dissipation of the ADA4304-2 can be calculated as

Table 2.

Parameter

Rating

Supply Voltage

Power Dissipation

Storage Temperature Range

Operating Temperature Range

Lead Temperature (Soldering, 10 sec)

Junction Temperature

5.5 V

See Figure 3

−65°C to +125°C

−40°C to +85°C

300°C

_{D (MAX)}= 5.25 V × 105 mA = 551 mW

Airflow increases heat dissipation, effectively reducing θ_JA.

In addition, more metal directly in contact with the package

leads/exposed pad from metal traces, through-holes, ground,

and power planes reduces the θ_JA.

150°C

Stresses above those listed under Absolute Maximum

Ratings may cause permanent damage to the device. This is

a stress rating only; functional operation of the device at

these or any other conditions above those indicated in the

operational section of this specification is not implied.

Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Figure 3 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 16-lead LFCSP

(98°C/W) on a JEDEC standard 4-layer board.

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

THERMAL RESISTANCE

θ_JAis specified for the device (including exposed pad)

soldered to a high thermal conductivity 2s2p circuit board,

as described in EIA/JESD 51-7.

Table 3. Thermal Resistance

Package Type

θ_JA

Unit

16-Lead LFCSP (Exposed Pad)

°C/W

100

AMBIENT TEMPERATURE (°C)

Maximum Power Dissipation

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

The maximum safe power dissipation in the ADA4304-2

package is limited by the associated rise in junction

temperature (T_J) on the die. At approximately 150°C,

which is the glass transition temperature, the plastic changes

its properties. Even temporarily exceeding this temperature

limit can change the stresses that the package exerts on the

die, permanently shifting the parametric performance of

the ADA4304-2. Exceeding a junction temperature of 150°C

for an extended period can result in changes in the silicon

devices, potentially causing failure.

ESD CAUTION

Rev. 0 | Page 4 of 12

1 2 345 6 7...12

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