Preliminary Technical Data
AD9983A
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
EXPLANATION OF TEST LEVELS
Rating
I. 100% production tested.
VD
1.98 V
VDD
PVD
DAVDD
Analog Inputs
REFHI
REFLO
Digital Inputs
Digital Output Current
Operating Temperature
Storage Temperature
Maximum Junction Temperature
Maximum Case Temperature
3.6 V
1.98 V
1.98 V
II. 100% production tested at 25°C and sample tested at
specified temperatures.
III. Sample tested only.
VD to 0.0 V
VD to 0.0 V
VD to 0.0 V
5 V to 0.0 V
20 mA
−25°C to + 85°C
−65°C to + 150°C
150°C
IV. Parameter is guaranteed by design and characterization
testing.
V. Parameter is a typical value only.
VI. 100% production tested at 25°C; guaranteed by design and
characterization testing.
THERMAL RESISTANCE
150°C
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3. Thermal Resistance
Package Type
80-lead LQFP
64-lead LFCSP
θJA
35
35
θJC
16
16
Unit
°C/W
°C/W
ESD CAUTION
Rev. PrA | Page 5 of 44