Datasheet > AD9430/PCB-CMOS

AD9430/PCB-CMOS

更新时间： 2022-11-25 11:34:30

品牌	Logo	应用领域
亚德诺 - ADI		转换器
页数	文件大小	规格书
20页	1592K
描述
12-Bit, 170 MSPS 3.3V A/D Converter

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数据手册

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AD9430/PCB-CMOS 数据手册

PRELIMINARY TECHNICAL DATA

AD9430

Troubleshooting

If the board does not seem to be working correctly, try the following:

The AD9430 Evaluation Board is provided as a design example

for customers of Analog Devices, Inc. ADI makes no warranties,

express, statutory, or implied, regarding merchantability or

fitness for a particular purpose.

•

Verify power at IC pins.

Check that all jumpers are in the correct position for the

desired mode of operation.

•

Verify VREF is at 1.23 V.

Try running Encode Clock and Analog Inputs at low speeds

(10 MSPS/1 MHz) and monitor 574, DAC, and ADC outputs

for toggling.

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

100-Lead TQFP (with Exposed Heat Sink)

(TQFP-100)

0.047 (1.20)

MAX

0.630 (16.00) SQ

0.551 (14.00) SQ

0.030 (0.75)

0.024 (0.60)

0.018 (0.45)

100

BOTTOM VIEW

SEATING

PLANE

TOP VIEW

(PINS DOWN)

CONDUCTIVE

HEAT SINK

0.041 (1.05)

0.039 (1.00)

0.037 (0.95)

0.006 (0.15)

0.002 (0.05)

0.260 (6.00) NOM

CONTROLLING DIMENSIONS ARE IN MILLIMETERS.

CENTER FIGURES ARE TYPICAL UNLESS

OTHERWISE NOTED.

0.011 (0.27)

0.009 (0.22)

0.007 (0.17)

0.0197 (0.50)

BSC

7؇

0؇

NOTE:

THE AD9430 HAS A CONDUCTIVE HEAT SLUG TO HELP DISSIPATE HEAT AND ENSURE RELIABLE OPERATION OF

THE DEVICE OVER THE FULL INDUSTRIAL TEMPERATURE RANGE. THE SLUG IS EXPOSED ON THE BOTTOM OF

THE PACKAGE AND ELECTRICALLY CONNECTED TO CHIP GROUND. IT IS RECOMMENDED THAT NO PCB SIGNAL

TRACES OR VIAS BE LOCATED UNDER THE PACKAGE THAT COULD COME IN CONTACT WITH THE CONDUCTIVE

SLUG. ATTACHING THE SLUG TO A GROUND PLANE WILL REDUCE THE JUNCTION TEMPERATURE OF THE DEVICE

WHICH MAY BE BENEFICIAL IN HIGH TEMPERATURE ENVIRONMENTS.

-20-

4/01/2002 REV. PrG

1...17 18 1920

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