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AD8567ACP-REEL7

更新时间： 2024-01-27 20:59:43
品牌 Logo 应用领域
亚德诺 - ADI 运算放大器
页数 文件大小 规格书
16页 315K
描述
16 V Rail-to-Rail Operational Amplifiers

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AD8567ACP-REEL7 技术参数

Source Url Status Check Date：2013-05-01 14:56:28.72是否无铅： 含铅
是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：QFN包装说明：4 X 4 MM, MO-220VGGC, LFCSP-16
针数：16Reach Compliance Code：not_compliant
ECCN代码：EAR99HTS代码：8542.33.00.01
风险等级：5.12放大器类型：OPERATIONAL AMPLIFIER
架构：VOLTAGE-FEEDBACK最大平均偏置电流 (IIB)：0.8 µA
25C 时的最大偏置电流 (IIB)：0.6 µA标称共模抑制比：95 dB
频率补偿：YES最大输入失调电压：10000 µV
JESD-30 代码：S-XQCC-N16JESD-609代码：e0
长度：4 mm低-偏置：NO
低-失调：NO微功率：NO
湿度敏感等级：3功能数量：4
端子数量：16最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：HVQCCN封装等效代码：LCC16,.16SQ,25
封装形状：SQUARE封装形式：CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
包装方法：TAPE AND REEL峰值回流温度（摄氏度）：240
功率：NO电源：4.5/16 V
可编程功率：NO认证状态：Not Qualified
座面最大高度：1 mm最小摆率：4 V/us
标称压摆率：6 V/us子类别：Operational Amplifiers
最大压摆率：4 mA供电电压上限：18 V
标称供电电压 (Vsup)：4.5 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Tin/Lead (Sn85Pb15)端子形式：NO LEAD
端子节距：0.65 mm端子位置：QUAD
处于峰值回流温度下的最长时间：30标称均一增益带宽：5000 kHz
最小电压增益：3000宽带：NO
宽度：4 mmBase Number Matches：1

AD8567ACP-REEL7 数据手册

 浏览型号AD8567ACP-REEL7的Datasheet PDF文件第7页浏览型号AD8567ACP-REEL7的Datasheet PDF文件第8页浏览型号AD8567ACP-REEL7的Datasheet PDF文件第9页浏览型号AD8567ACP-REEL7的Datasheet PDF文件第11页浏览型号AD8567ACP-REEL7的Datasheet PDF文件第12页浏览型号AD8567ACP-REEL7的Datasheet PDF文件第13页 
AD8565/AD8566/AD8567  
This input current is not inherently damaging to the device as  
long as it is limited to 5 mA or less. If a condition exists using  
the AD856x where the input exceeds the supply more than  
0.6 V, an external series resistor should be added. The size of the  
resistor can be calculated by using the maximum overvoltage  
divided by 5 mA. This resistance should be placed in series with  
either input exposed to an overvoltage.  
The power dissipated by the device can be calculated as  
DISS = (VS − VOUT) × ILOAD  
P
where:  
VS is the supply voltage.  
V
OUT is the output voltage.  
OUTPUT PHASE REVERSAL  
I
LOAD is the output load current.  
The AD856x family is immune to phase reversal. Although the  
device’s output does not change phase, large currents due to  
input overvoltage could damage the device. In applications  
where the possibility of an input voltage exceeding the supply  
voltage exists, overvoltage protection should be used as  
described in the Input Overvoltage Protection section.  
Figure 30 shows the maximum power dissipation vs.  
temperature. To achieve proper operation, use the previous  
equation to calculate PDISS for a specific package at any given  
temperature or use Figure 30.  
1.25  
14-LEAD SOIC  
1.00  
POWER DISSIPATION  
The maximum allowable internal junction temperature of  
150°C limits the AD856x family’s maximum power dissipation  
of AD856x devices. As the ambient temperature increases, the  
maximum power dissipated by AD856x devices must decrease  
linearly to maintain the maximum junction temperature. If this  
maximum junction temperature is exceeded momentarily, the  
device still operates properly once the junction temperature is  
reduced below 150°C. If the maximum junction temperature is  
exceeded for an extended period, overheating could lead to  
permanent damage of the device.  
0.75  
0.50  
0.25  
0
14-LEAD TSSOP  
8-LEAD MSOP  
5-LEAD SOT-23  
–35  
–15  
5
25  
45  
65  
85  
AMBIENTTEMPERATURE (°C)  
The maximum safe junction temperature, TJMAX, is 150°C. Using  
the following formula, the maximum power that an AD856x  
device can safely dissipate as a function of temperature can be  
obtained:  
Figure 30. Maximum Power Dissipation vs. Temperature  
for 5-Lead SC70, 8-Lead MSOP, and 14-Lead TSSOP/SOIC Packages  
THERMAL PAD—AD8567  
The AD8567 LFCSP comes with a thermal pad that is attached  
to the substrate. This substrate is connected to VDD. To be  
electrically safe, the thermal pad should be soldered to an area  
P
DISS = TJMAX − TA/θJA  
where:  
DISS is the AD856x power dissipation.  
JMAX is the AD856x maximum allowable junction temperature  
on the board that is electrically isolated or connected to VDD  
Attaching the thermal pad to ground adversely affects the  
performance of the part.  
.
P
T
(150°C).  
Soldering down this thermal pad dramatically improves the  
heat dissipation of the package. It is necessary to attach vias that  
connect the soldered thermal pad to another layer on the board.  
This provides an avenue to dissipate the heat away from the  
part. Without vias, the heat is isolated directly under the part.  
TA is the ambient temperature of the circuit.  
θJA is the AD856x package thermal resistance, junction-to-ambient.  
Rev. D | Page 10 of 16  
 
 
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