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AD8389ACPZ PDF预览

AD8389ACPZ

更新时间: 2024-02-24 12:25:57
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 商用集成电路
页数 文件大小 规格书
13页 1171K
描述
SPECIALTY CONSUMER CIRCUIT, QCC48, LEAD FREE, MO-220-VKKD-2, LFCSP-48

AD8389ACPZ 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:QFN
包装说明:HVQCCN,针数:48
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.68
商用集成电路类型:CONSUMER CIRCUITJESD-30 代码:S-XQCC-N48
JESD-609代码:e3长度:7 mm
湿度敏感等级:3功能数量:1
端子数量:48最高工作温度:85 °C
最低工作温度:封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
表面贴装:YES温度等级:OTHER
端子面层:Matte Tin (Sn)端子形式:NO LEAD
端子节距:0.5 mm端子位置:QUAD
处于峰值回流温度下的最长时间:40宽度:7 mm
Base Number Matches:1

AD8389ACPZ 数据手册

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AD8389  
ABSOLUTE MAXIMUM RATINGS  
Table 2. AD8389 Stress Ratings1  
Parameter  
EXPOSED PADDLE  
Rating  
To ensure high reliability, the exposed paddle must be soldered  
to GND.  
Supply Voltages  
AVDDx – AVSSx  
DRVDDx – DRVSSx  
3.9 V  
3.9 V  
MAXIMUM POWER DISSIPATION  
Input Voltages  
The maximum power that can be safely dissipated by the  
AD8389 is limited by its junction temperature. The maximum  
safe junction temperature for plastic encapsulated devices as  
determined by the glass transition temperature of the plastic is  
approximately 150°C. Exceeding this limit temporarily may  
cause a shift in the parametric performance due to a change in  
the stresses exerted on the die by the package. Exceeding a  
junction temperature of 175°C for an extended period can  
result in device failure.  
Maximum Digital Input Voltage  
Minimum Digital Input Voltage  
Internal Power Dissipation2  
LFCSP Package @ TA = 25°C  
Operating Temperature Range  
Storage Temperature Range  
Lead Temperature Range (Soldering 10 sec)  
AVDD + 0.3 V  
AVSS – 0.3 V  
4.8 W  
0°C to 85°C  
–65°C to +125°C  
300°C  
1 Stresses above those listed under the Absolute Maximum Ratings may cause  
permanent damage to the device. This is a stress rating only; functional  
operation of the device at these or any other conditions above those  
indicated in the operational section of this specification is not implied.  
Exposure to the absolute maximum ratings for extended periods may  
reduce device reliability.  
To ensure operation within the specified operating temperature  
range, it is necessary to limit the maximum power dissipation as  
follows:  
2 48-Lead LFCSP Package:  
θJA = 26°C/W (JEDEC Standard 4-layer PCB in still air)  
θJC = 20°C/W  
P
DMAX = (TJMAX TA)/θJA  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
25  
35  
45  
55  
65  
75  
85  
95  
AMBIENT TEMPERATURE (°C)  
Figure 2. Maximum Power Dissipation vs. Ambient Temperature  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection. Although  
this product features proprietary ESD protection circuitry, permanent damage may occur on devices  
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are  
recommended to avoid performance degradation or loss of functionality.  
Rev. 0 | Page 4 of 12  
 

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