AD8386
ABSOLUTE MAXIMUM RATINGS
MAXIMUM POWER DISSIPATION
Table 3.
The maximum power that can be safely dissipated by the
AD8386 is limited by its junction temperature. The maximum
safe junction temperature for plastic encapsulated devices, as
determined by the glass transition temperature of the plastic, is
approximately 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
Parameter
Rating
Supply Voltage
AVCCx − AGNDx
DVCC − DGND
Input Voltage
18 V
4.5 V
Maximum Digital Input Voltage
Minimum Digital Input Voltage
Maximum Analog Input Voltage
Minimum Analog Input Voltage
Internal Power Dissipation1
LFCSP @ TA = 25°C
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range
(Soldering 10 sec)
DVCC + 0.5 V
DGND − 0.5 V
AVCC + 0.5 V
AGND − 0.5 V
OVERLOAD PROTECTION
3.7 W
The AD8386 overload protection circuit consists of an output
current limiter and a thermal protection circuit.
0°C to 85°C
–65°C to +125°C
300°C
When TSW is LOW, the thermal protection circuit is disabled,
and the output current limiter is turned on. The maximum
current at any one output of the AD8386 is internally limited to
100 mA average. In the event of a momentary short circuit
between a video output and a power supply rail (AVCC or
AGND), the output current limit is sufficiently low to provide
temporary protection.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
When TSW is HIGH, the output current limiter, as well as the
thermal protection circuit, is turned on. The thermal protection
circuit debiases the output amplifier when the junction
temperature reaches the internally set trip point. In the event of
an extended short circuit between a video output and a power
supply rail, the output amplifier current continues to switch
between 0 mA and 100 mA typical with a period determined by
the thermal time constant and the hysteresis of the thermal trip
point. The thermal protection circuit limits the average junction
temperature to a safe level, which provides long-term
protection.
1 64-lead VQ_LFCSP:
θJA = 27°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
θJA = 25°C/W @ 200 lfm airflow (JEDEC STD, 4-layer PCB with 16 vias on Epad)
θJA = 24°C/W @ 400 lfm airflow (JEDEC STD, 4-layer PCB with 16 vias on Epad)
ΨJT = 0.2°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
ΨJB = 13.8°C/W in still air (JEDEC STD, 4-layer PCB with 16 vias on Epad)
EXPOSED PADDLE
To ensure optimal thermal performance, the exposed paddle
must be electrically connected to an external plane, such as
AVCC or GND, as described in the Applications section.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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