AD8236
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
The difference between the total drive power and the load power is
the drive power dissipated in the package.
Rating
Supply Voltage
Power Dissipation
6 V
PD = Quiescent Power + (Total Drive Power – Load Power)
See Figure 3
55 mA
VS
VS
−65°C to +125°C
−40°C to +125°C
300°C
2
⎛
⎜
⎜
⎝
⎞
⎟
⎟
⎠
VS VOUT
VOUT
RL
Output Short-Circuit Current
Input Voltage (Common Mode)
Differential Input Voltage
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
θJA (4-Layer JEDEC Standard Board)
8-Lead MSOP
PD =
(
VS ×IS
)
+
×
–
2
RL
RMS output voltages should be considered. If RL is referenced to
−VS, as in single-supply operation, the total drive power is VS ×
IOUT. If the rms signal levels are indeterminate, consider the worst
case, when VOUT = VS/4 for RL to midsupply
140°C
2
VS /4
RL
)
PD =
(
VS ×IS +
)
135°C/W
140°C
Package Glass Transition Temperature
8-Lead MSOP
ESD
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA. In
addition, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes
reduces the θJA.
Human Body Model
Charge Device Model
Machine Model
2 kV
1 kV
200 V
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3 shows the maximum safe power dissipation in the package
vs. the ambient temperature for the 8-lead MSOP on a 4-layer
JEDEC standard board. θJA values are approximations.
2.00
1.75
1.50
1.25
1.00
0.75
0.50
0.25
0
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation in the package of the
AD8236 is limited by the associated rise in junction temperature
(TJ) on the die. The plastic encapsulating the die locally reaches
the junction temperature. At approximately 140°C, which is the
glass transition temperature, the plastic changes its properties.
Even temporarily exceeding this temperature limit may change
the stresses that the package exerts on the die, permanently
shifting the parametric performance of the AD8236.
–40
–20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
The still-air thermal properties of the package and PCB (θJA),
the ambient temperature (TA), and the total power dissipated in
the package (PD) determine the junction temperature of the die.
The junction temperature is calculated as
Figure 3. Maximum Power Dissipation vs. Ambient Temperature
ESD CAUTION
TJ = TA + (PD × θJA)
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (VS) times the
quiescent current (IS). Assuming the load (RL) is referenced to
midsupply, the total drive power is VS/2 × IOUT, some of which
is dissipated in the package and some in the load (VOUT × IOUT).
Rev. 0 | Page 7 of 20
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