AD8183/AD8185
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.0 V
DVCC to VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.2 V
Internal Power Dissipation2, 3
AD8183/AD8185 24-Lead TSSOP (RU) . . . . . . . . . . . . . 1 W
Input Voltage
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B . . . . . VEE ≤ VIN ≤ VCC
SELECT A/B, OE . . . . . . . . . . . . . . . . . . DGND ≤ VIN ≤ VCC
Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . Indefinite3
Storage Temperature Range . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . . . 300°C
2.0
1.5
1.0
0.5
T = 150؇C
J
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air (TA = 25°C).
0
–50 –40 –30 –20 –10
0
10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE – ؇C
Figure 2. Maximum Power Dissipation vs. Temperature
324-lead plastic TSSOP; θJA = 128°C/W. Maximum internal power dissipation (PD
)
should be derated for ambient temperature (TA) such that PD < (150°C–TA)/θJA
.
PIN CONFIGURATION
ORDERING GUIDE
1
2
24
23
22
21
20
19
18
17
16
15
14
13
IN0A
DGND
IN1A
V
CC
Temperature
Range
Package
Description
Package
Option
OE
Model
3
SEL A/B
AD8183ARU
AD8185ARU
AD8183-EVAL
AD8185-EVAL
–40°C to +85°C 24-Lead Plastic TSSOP RU-24
–40°C to +85°C 24-Lead Plastic TSSOP RU-24
Evaluation Board
GND
4
V
CC
AD8183/
AD8185
5
IN2A
OUT0
6
V
V
EE
CC
TOP VIEW
(Not to Scale)
Evaluation Board
7
V
OUT1
EE
8
IN2B
GND
IN1B
GND
IN0B
V
CC
MAXIMUM POWER DISSIPATION
9
OUT2
The maximum power that can be safely dissipated by the AD8183/
AD8185 is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this
limit may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceeding
a junction temperature of 175°C for an extended period can
result in device failure.
10
11
12
V
EE
DVCC
V
CC
While the AD8183/AD8185 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves shown in Figure 2.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8183/AD8185 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. 0
–3–