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AD8138ARMZ-REEL7 PDF预览

AD8138ARMZ-REEL7

更新时间: 2024-01-03 15:18:24
品牌 Logo 应用领域
亚德诺 - ADI 驱动器
页数 文件大小 规格书
24页 451K
描述
Low Distortion Differential ADC Driver

AD8138ARMZ-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP,针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.31.00.01风险等级:0.83
差分输出:YES驱动器位数:1
输入特性:DIFFERENTIAL接口集成电路类型:LINE DRIVER
接口标准:GENERAL PURPOSEJESD-30 代码:S-PDSO-G8
JESD-609代码:e3长度:3 mm
湿度敏感等级:1标称负供电电压:-5 V
功能数量:1端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:SQUARE封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大接收延迟:座面最大高度:1.1 mm
最大供电电压:5.5 V最小供电电压:1.4 V
标称供电电压:5 V表面贴装:YES
技术:BIPOLAR温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:3 mm
Base Number Matches:1

AD8138ARMZ-REEL7 数据手册

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AD8138  
ABSOLUTE MAXIMUM RATINGS  
Table 5.  
Parameter  
The power dissipated in the package (PD) is the sum of the  
Ratings  
quiescent power dissipation and the power dissipated in the  
package due to the load drive for all outputs. The quiescent  
power is the voltage between the supply pins (VS) times the  
quiescent current (IS). The load current consists of the differential  
and common-mode currents flowing to the load, as well as  
currents flowing through the external feedback networks and  
internal common-mode feedback loop. The internal resistor tap  
used in the common-mode feedback loop places a negligible  
differential load on the output. RMS voltages and currents  
should be considered when dealing with ac signals.  
Supply Voltage  
VOCM  
5.5 V  
VS  
550 mW  
−40°C to +85°C  
−65°C to +150°C  
300°C  
Internal Power Dissipation  
Operating Temperature Range  
Storage Temperature Range  
Lead Temperature (Soldering 10 sec)  
Junction Temperature  
150°C  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Airflow reduces θJA. In addition, more metal directly in contact  
with the package leads from metal traces through holes, ground,  
and power planes reduces the θJA.  
Figure 3 shows the maximum safe power dissipation in the  
package vs. the ambient temperature for the 8-lead SOIC  
(121°C/W) and 8-lead MSOP (θJA = 145°C/W) packages on a  
JEDEC standard 4-layer board. θJA values are approximations.  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, θJA is  
specified for the device soldered in a circuit board in still air.  
1.75  
Table 6.  
Package Type  
1.50  
1.25  
θJA  
Unit  
°C/W  
°C/W  
8-Lead SOIC/4-Layer  
8-Lead MSOP/4-Layer  
121  
145  
1.00  
SOIC  
Maximum Power Dissipation  
0.75  
The maximum safe power dissipation in the AD8138 packages  
is limited by the associated rise in junction temperature (TJ) on  
the die. At approximately 150°C, which is the glass transition  
temperature, the plastic changes its properties. Even temporarily  
exceeding this temperature limit can change the stresses that the  
package exerts on the die, permanently shifting the parametric  
performance of the AD8138. Exceeding a junction temperature  
of 150°C for an extended period can result in changes in the  
silicon devices, potentially causing failure.  
MSOP  
0.50  
0.25  
0
–40 –30 –20 –10  
0
10 20 30 40 50 60 70 80 90 100 110 120  
AMBIENT TEMPERATURE (°C)  
Figure 3. Maximum Power Dissipation vs. Temperature  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on  
the human body and test equipment and can discharge without detection. Although this product features  
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy  
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance  
degradation or loss of functionality.  
Rev. F | Page 7 of 24  
 
 

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