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AD7873ARQ PDF预览

AD7873ARQ

更新时间: 2024-02-20 17:05:38
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 光电二极管商用集成电路
页数 文件大小 规格书
29页 1547K
描述
SPECIALTY CONSUMER CIRCUIT, PDSO16, 0.150 INCH, MO-137AB, QSOP-16

AD7873ARQ 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:SSOP
包装说明:0.150 INCH, MO-137AB, QSOP-16针数:16
Reach Compliance Code:unknown风险等级:5.62
其他特性:FUNCTIONALLY IT OPERATES FROM 2.2 TO 5.25V商用集成电路类型:CONSUMER CIRCUIT
JESD-30 代码:R-PDSO-G16JESD-609代码:e0
长度:4.9022 mm湿度敏感等级:1
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):240认证状态:COMMERCIAL
座面最大高度:1.7526 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.2 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.635 mm
端子位置:DUAL处于峰值回流温度下的最长时间:30
宽度:3.9116 mmBase Number Matches:1

AD7873ARQ 数据手册

 浏览型号AD7873ARQ的Datasheet PDF文件第4页浏览型号AD7873ARQ的Datasheet PDF文件第5页浏览型号AD7873ARQ的Datasheet PDF文件第6页浏览型号AD7873ARQ的Datasheet PDF文件第8页浏览型号AD7873ARQ的Datasheet PDF文件第9页浏览型号AD7873ARQ的Datasheet PDF文件第10页 
AD7873  
ABSOLUTE MAXIMUM RATINGS  
TA = 25°C, unless otherwise noted.  
Table 3.  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
Parameter  
Rating  
+VCC to GND  
–0.3 V to +7 V  
Analog Input Voltage to GND  
Digital Input Voltage to GND  
Digital Output Voltage to GND  
VREF to GND  
Input Current to Any Pin Except Supplies1  
Operating Temperature Range  
Commercial (A, B Versions)  
Storage Temperature Range  
Junction Temperature  
Power Dissipation  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
–0.3 V to VCC + 0.3 V  
10 mA  
THERMAL RESISTANCE  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
–40°C to +85°C  
–65°C to +150°C  
150°C  
Table 4. Thermal Resistance  
Package Type  
16-Lead QSOP  
16-Lead TSSOP  
16-Lead LFCSP  
θJA  
θJC  
Unit  
°C/W  
°C/W  
°C/W  
149.97  
150.4  
135.7  
38.8  
27.6  
450 mW  
IR Reflow Soldering  
Peak Temperature  
Time-to-Peak Temperature  
Ramp-Down Rate  
220°C ( 5°C)  
10 sec to 30 sec  
6°C/sec max  
ESD CAUTION  
Pb-free Parts Only  
Peak Temperature  
250°C  
Time-to-Peak Temperature  
Ramp-Up Rate  
Ramp-Down Rate  
20 sec to 40 sec  
3°C/sec max  
6°C/sec max  
1 Transient currents of up to 100 mA do not cause SCR latch-up.  
Rev. E | Page 6 of 28  
 
 

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