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AD7357BRUZ-RL PDF预览

AD7357BRUZ-RL

更新时间: 2024-02-23 08:30:47
品牌 Logo 应用领域
亚德诺 - ADI /
页数 文件大小 规格书
17页 196K
描述
Differential Input,Dual,Simultaneous Sampling, 4.25 MSPS, 14-Bit, SAR ADC

AD7357BRUZ-RL 技术参数

是否无铅:含铅是否Rohs认证:符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP, TSSOP16,.25针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.24
Samacsys Confidence:3Samacsys Status:Released
2D Presentation:https://componentsearchengine.com/2D/0T/578578.3.1.pngSchematic Symbol:https://componentsearchengine.com/symbol.php?partID=578578
PCB Footprint:https://componentsearchengine.com/footprint.php?partID=5785783D View:https://componentsearchengine.com/viewer/3D.php?partID=578578
Samacsys PartID:578578Samacsys Image:https://componentsearchengine.com/Images/9/AD7357YRUZ-RL.jpg
Samacsys Thumbnail Image:https://componentsearchengine.com/Thumbnails/3/AD7357YRUZ-RL.jpgSamacsys Pin Count:16
Samacsys Part Category:Integrated CircuitSamacsys Package Category:Small Outline Packages
Samacsys Footprint Name:16 PIN TSSOPSamacsys Released Date:2017-01-11 11:21:59
Is Samacsys:N最大模拟输入电压:1.6 V
最小模拟输入电压:0.5 V最长转换时间:0.238 µs
转换器类型:ADC, SUCCESSIVE APPROXIMATIONJESD-30 代码:R-PDSO-G16
JESD-609代码:e3长度:5 mm
最大线性误差 (EL):0.0183%湿度敏感等级:1
模拟输入通道数量:2位数:14
功能数量:1端子数量:16
最高工作温度:125 °C最低工作温度:-40 °C
输出位码:BINARY输出格式:SERIAL
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP16,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:2.5 V认证状态:Not Qualified
采样速率:4.2 MHz采样并保持/跟踪并保持:TRACK
座面最大高度:1.2 mm子类别:Analog to Digital Converters
标称供电电压:2.5 V表面贴装:YES
技术:CMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:4.4 mm
Base Number Matches:1

AD7357BRUZ-RL 数据手册

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AD7357  
Preliminary Technical Data  
ABSOLUTE MAXIMUM RATINGS  
Table 3.  
Parameter  
Rating  
Stresses above those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. This is a stress  
rating only; functional operation of the device at these or any  
other conditions above those indicated in the operational  
section of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods may affect  
device reliability.  
VDD to AGND, DGND, REFGND  
0.3 V to +2.8V  
−0.3 V to +3.8V  
+2.8V to −3.8V  
0.3 V to +0.3 V  
0.3 V to VDD + 0.3 V  
−0.3V to VDRIVE + 0.3V  
0.3 V to VDRIVE + 0.3 V  
10 mA  
VDRIVE to AGND, DGND, REFGND  
VDD to VDRIVE  
AGND to DGND to REFGND  
Analog Input Voltages1 to AGND  
Digital Input Voltages2 to DGND  
Digital Output Voltages3 to DGND  
Input Current to Any Pin Except  
Supplies4  
Operating Temperature Range  
Y Grade  
40ꢂC to +125ꢂC  
40ꢂC to +85ꢂC  
65ꢂC to +150ꢂC  
150ꢂC  
B Grade  
Storage Temperature Range  
Junction Temperature  
TSSOP Package  
θJA Thermal Impedance  
θJC Thermal Impedance  
Lead Temperature, Soldering  
Reflow Temperature (10 to 30 sec)  
ESD  
143ꢂC/W  
45ꢂC/W  
255ꢂC  
TBD kV  
1 Analog input voltages are VINA+, VINA-, VINB+, VINB-, REFA and REFB.  
2
CS  
Digital input voltages are  
and SCLK.  
3 Digital output voltages are SDATAA and SDATAB.  
4 Transient currents of up to 100 mA will not cause SCR latch up.  
ESD CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate  
on the human body and test equipment and can discharge without detection. Although this product  
features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to  
high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid  
performance degradation or loss of functionality.  
Rev. PrD | Page 6 of 17  

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