AD73311L
ABSOLUTE MAXIMUM RATINGS*
(TA = 25°C unless otherwise noted)
PIN CONFIGURATION
AVDD, DVDD to GND . . . . . . . . . . . . . . . –0.3 V to +4.6 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Digital I/O Voltage to DGND . . . –0.3 V to (DVDD + 0.3 V)
Analog I/O Voltage to AGND . . . –0.3 V to (AVDD + 0.3 V)
Operating Temperature Range
Industrial (A Version) . . . . . . . . . . . . . . . –40°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
SOIC, θJA Thermal Impedance . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
SSOP, θJA Thermal Impedance . . . . . . . . . . . . . . . . 126°C/W
Lead Temperature, Soldering
VOUTP
1
2
20
19
SE
VOUTN
AVDD1
AGND1
VINP
SDI
3
18 SDIFS
4
17 SDOFS
SDO
16
5
AD73311L
TOP VIEW
(Not to Scale)
6
MCLK
SCLK
RESET
DVDD
VINN
REFOUT
REFCAP
AVDD2
15
14
13
12
11
7
8
9
DGND
10
AGND2
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
TSSOP, θJA Thermal Impedance . . . . . . . . . . . . . . . 143°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
ORDERING GUIDE
Temperature
Range
Package
Option1
Model
AD73311LAR
–40°C to +105°C
–40°C to +105°C
–40°C to +105°C
Evaluation Board2
R-20
RS-20
RU-20
AD73311LARS
AD73311LARU
EVAL-AD73311LEB
NOTES
1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP),
RU = Thin Small Shrink Outline Package (TSSOP).
2The AD73311L evaluation board features a cascade of two codecs interfaced to
an ADSP-2185L DSP. The board features a DSP software monitor which
allows interface to a PC serial port.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD73311L features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–6–
REV. A