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AD73311LARS-REEL7 PDF预览

AD73311LARS-REEL7

更新时间: 2024-01-29 00:50:28
品牌 Logo 应用领域
亚德诺 - ADI 电信光电二极管电信集成电路
页数 文件大小 规格书
36页 375K
描述
IC SPECIALTY TELECOM CIRCUIT, PDSO20, SSOP-20, Telecom IC:Other

AD73311LARS-REEL7 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:SSOP
包装说明:SSOP,针数:20
Reach Compliance Code:unknown风险等级:5.03
JESD-30 代码:R-PDSO-G20JESD-609代码:e0
长度:7.2 mm湿度敏感等级:1
功能数量:1端子数量:20
最高工作温度:105 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, SHRINK PITCH
峰值回流温度(摄氏度):240认证状态:COMMERCIAL
座面最大高度:2 mm标称供电电压:3 V
表面贴装:YES技术:CMOS
电信集成电路类型:TELECOM CIRCUIT温度等级:INDUSTRIAL
端子面层:TIN LEAD端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:5.3 mm
Base Number Matches:1

AD73311LARS-REEL7 数据手册

 浏览型号AD73311LARS-REEL7的Datasheet PDF文件第3页浏览型号AD73311LARS-REEL7的Datasheet PDF文件第4页浏览型号AD73311LARS-REEL7的Datasheet PDF文件第5页浏览型号AD73311LARS-REEL7的Datasheet PDF文件第7页浏览型号AD73311LARS-REEL7的Datasheet PDF文件第8页浏览型号AD73311LARS-REEL7的Datasheet PDF文件第9页 
AD73311L  
ABSOLUTE MAXIMUM RATINGS*  
(TA = 25°C unless otherwise noted)  
PIN CONFIGURATION  
AVDD, DVDD to GND . . . . . . . . . . . . . . . 0.3 V to +4.6 V  
AGND to DGND . . . . . . . . . . . . . . . . . . . . 0.3 V to +0.3 V  
Digital I/O Voltage to DGND . . . 0.3 V to (DVDD + 0.3 V)  
Analog I/O Voltage to AGND . . . 0.3 V to (AVDD + 0.3 V)  
Operating Temperature Range  
Industrial (A Version) . . . . . . . . . . . . . . . 40°C to +105°C  
Storage Temperature Range . . . . . . . . . . . . 65°C to +150°C  
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C  
SOIC, θJA Thermal Impedance . . . . . . . . . . . . . . . . . 75°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
SSOP, θJA Thermal Impedance . . . . . . . . . . . . . . . . 126°C/W  
Lead Temperature, Soldering  
VOUTP  
1
2
20  
19  
SE  
VOUTN  
AVDD1  
AGND1  
VINP  
SDI  
3
18 SDIFS  
4
17 SDOFS  
SDO  
16  
5
AD73311L  
TOP VIEW  
(Not to Scale)  
6
MCLK  
SCLK  
RESET  
DVDD  
VINN  
REFOUT  
REFCAP  
AVDD2  
15  
14  
13  
12  
11  
7
8
9
DGND  
10  
AGND2  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
TSSOP, θJA Thermal Impedance . . . . . . . . . . . . . . . 143°C/W  
Lead Temperature, Soldering  
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C  
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C  
*Stresses above those listed under Absolute Maximum Ratings may cause perma-  
nent damage to the device. This is a stress rating only; functional operation of the  
device at these or any other conditions above those listed in the operational sections  
of this specication is not implied. Exposure to absolute maximum rating condi-  
tions for extended periods may affect device reliability.  
ORDERING GUIDE  
Temperature  
Range  
Package  
Option1  
Model  
AD73311LAR  
40°C to +105°C  
40°C to +105°C  
40°C to +105°C  
Evaluation Board2  
R-20  
RS-20  
RU-20  
AD73311LARS  
AD73311LARU  
EVAL-AD73311LEB  
NOTES  
1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP),  
RU = Thin Small Shrink Outline Package (TSSOP).  
2The AD73311L evaluation board features a cascade of two codecs interfaced to  
an ADSP-2185L DSP. The board features a DSP software monitor which  
allows interface to a PC serial port.  
CAUTION  
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily  
accumulate on the human body and test equipment and can discharge without detection.  
Although the AD73311L features proprietary ESD protection circuitry, permanent damage may  
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD  
precautions are recommended to avoid performance degradation or loss of functionality.  
WARNING!  
ESD SENSITIVE DEVICE  
–6–  
REV. A  

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