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AD7152BRMZ-REEL PDF预览

AD7152BRMZ-REEL

更新时间: 2024-01-09 22:33:31
品牌 Logo 应用领域
亚德诺 - ADI 转换器模拟IC信号电路光电二极管
页数 文件大小 规格书
24页 474K
描述
12-Bit Capacitance-to-Digital Converter

AD7152BRMZ-REEL 技术参数

Source Url Status Check Date:2013-05-01 14:56:16.701是否无铅:含铅
是否Rohs认证:符合生命周期:Obsolete
零件包装代码:TSSOP包装说明:TSSOP, TSSOP10,.19,20
针数:10Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.39.00.01
风险等级:5.56Is Samacsys:N
模拟集成电路 - 其他类型:ANALOG CIRCUITJESD-30 代码:S-PDSO-G10
JESD-609代码:e3长度:3 mm
湿度敏感等级:1功能数量:1
端子数量:10最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP10,.19,20
封装形状:SQUARE封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):260电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.1 mm
子类别:Other Analog ICs最大供电电流 (Isup):0.12 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3 mmBase Number Matches:1

AD7152BRMZ-REEL 数据手册

 浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第1页浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第2页浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第3页浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第5页浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第6页浏览型号AD7152BRMZ-REEL的Datasheet PDF文件第7页 
AD7152/AD7153  
Parameter  
Min Typ  
Max Unit1  
Test Conditions/Comments  
POWER REQUIREMENTS  
VDD-to-GND Voltage  
Current, IDD  
2.7  
±00  
±
3.6  
±20  
V
VDD = 3.3 V, nominal  
9
μA  
μA  
μA  
9
Current Power-Down Mode, IDD  
Temperature ≤ 2ꢀ°C  
Temperature = 8ꢀ°C  
3
±0  
± Capacitance units: ± pF = ±0−±2 F; ± fF = ±0−±ꢀ F; ± aF = ±0−±8 F.  
2 Specification is not production tested but is supported by characterization data at initial product release.  
3 Except Channel 2 in differential mode. To achieve the specified performance in differential mode, the I2C interface must be idle during the capacitance conversion to  
prevent signal coupling from the SCL pin to the adjacent CIN2(−) pin.  
4
Factory calibrated. The absolute error includes factory gain calibration error and integral nonlinearity error all at 2ꢀ°C. At different temperatures, compensation for  
gain drift over temperature is required.  
Specification is not production tested but guaranteed by design.  
6 A system offset calibration is effectively a conversion; therefore, the offset error is of the order of the conversion noise. This applies after calibration at the temperature,  
capacitive input range, and applied VDD of interest. The capacitive input offset can be reduced using a system offset calibration. Large offsets should be removed using  
CAPDACs.  
7 The gain error is factory calibrated at 2ꢀ°C. At different temperatures, compensation for gain drift over temperature is required.  
8
The CAPDAC resolution is five bits in the actual CAPDAC full range. Using the on-chip offset calibration or adjusting the capacitive offset calibration register can  
further reduce the CIN offset or the unchanging CIN component.  
9 Digital inputs equal to VDD or GND.  
Rev. 0 | Page 4 of 24  

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