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AD667-703F PDF预览

AD667-703F

更新时间: 2024-01-07 10:33:23
品牌 Logo 应用领域
亚德诺 - ADI 转换器
页数 文件大小 规格书
5页 542K
描述
12-BIT DAC

AD667-703F 技术参数

生命周期:Active包装说明:DFP,
Reach Compliance Code:compliant风险等级:5.62
转换器类型:D/A CONVERTER输入位码:BINARY
输入格式:PARALLEL, WORDJESD-30 代码:R-CDFP-F28
最大线性误差 (EL):0.0183%标称负供电电压:-15 V
位数:12功能数量:1
端子数量:28最高工作温度:125 °C
最低工作温度:-55 °C封装主体材料:CERAMIC, METAL-SEALED COFIRED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK标称供电电压:15 V
表面贴装:YES温度等级:MILITARY
端子形式:FLAT端子位置:DUAL
Base Number Matches:1

AD667-703F 数据手册

 浏览型号AD667-703F的Datasheet PDF文件第2页浏览型号AD667-703F的Datasheet PDF文件第3页浏览型号AD667-703F的Datasheet PDF文件第4页浏览型号AD667-703F的Datasheet PDF文件第5页 
This specification documents the detail requirements for space qualified product manufactured on Analog  
Devices, Inc.’s QML certified line per MIL-PRF-38535 Level V except as modified herein. The manufacturing  
flow described in the STANDARD SPACE LEVEL PRODUCTS PROGRAM brochure is to be considered a  
part of this specification. http://www.analog.com/aerospace. This data sheet specifically details the space  
grade version of this product. A more detailed operational description and a complete data sheet for  
commercial product grades can be found at www.analog.com/AD667.  
:
Part Number  
AD667-703F  
AD667-703D  
AD667-713F  
Description  
Microprocessor-Compatible 12-Bit D/A Converter  
Microprocessor-Compatible 12-Bit D/A Converter  
Radiation Tested, Microprocessor-Compatible 12-Bit D/A Converter  
.
Letter  
D
F
Descriptive designator1  
CDIP2-T28  
CDFP3-F28  
Case Outline (Lead Finish per MIL-PRF-38535)  
28-Lead ceramic dual-in-line package (SIDEBRAZED)  
28-Lead bottom-brazed flatpack  
¹ See MIL-STD-1835  
VCC to power ground..............................................................................................0 to +18V  
VEE to power ground ...............................................................................................0 to -18V  
Digital inputs (pins 11-15, 17-28) to power ground ....................................... -1.0V to +7.0V  
Reference in to Reference ground ............................................................................... ±12V  
Bipolar offset to reference ground ................................................................................ ±12V  
10V span R to reference ground ................................................................................. ±12V  
20V span R to reference ground ................................................................................. ±24V  
REF OUT, VOUT (Pins 6, 9) ................................................... Indefinite short to power ground  
........... .......................................................................................... Momentary short to VCC  
Power dissipation....................................................................................................1000mW  
Storage temperature range ...........................................................................-65° to +150°C  
Lead temperature range (Soldering, 10sec)............................................................ +300°C  
Operating Temperature Range...................................................................-55°C to +125°C  
Junction Temperature (TJ)....................................................................................... +150°C  
:
Thermal Resistance, Sidebrazed (D) Package  
Junction-to-Case (4JC) = 25°C/W Max 22 for F  
Junction-to-Ambient (4JA) = 60°C/W Max 60 for F  

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