Datasheet > AD6645ASQ-105

AD6645ASQ-105

更新时间： 2024-02-29 10:09:30

品牌	Logo	应用领域
亚德诺 - ADI		转换器
页数	文件大小	规格书
24页	776K
描述
14-Bit, 80 MSPS/105 MSPS A/D Converter

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技术参数
数据手册

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AD6645ASQ-105 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Active	零件包装代码：	QFP
包装说明：	HLQFP,	针数：	52
Reach Compliance Code：	unknown	风险等级：	5.89
最大模拟输入电压：	2.2 V	最小模拟输入电压：
转换器类型：	ADC, PROPRIETARY METHOD	JESD-30 代码：	S-PQFP-G52
JESD-609代码：	e0	长度：	12 mm
湿度敏感等级：	NOT APPLICABLE	模拟输入通道数量：	1
位数：	14	功能数量：	1
端子数量：	52	最高工作温度：	85 °C
最低工作温度：	-10 °C	输出位码：	2'S COMPLEMENT BINARY
输出格式：	PARALLEL, WORD	封装主体材料：	PLASTIC/EPOXY
封装代码：	HLQFP	封装形状：	SQUARE
封装形式：	FLATPACK, HEAT SINK/SLUG, LOW PROFILE	峰值回流温度（摄氏度）：	220
采样速率：	105 MHz	采样并保持/跟踪并保持：	TRACK
座面最大高度：	1.6 mm	标称供电电压：	5 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	OTHER	端子面层：	TIN LEAD
端子形式：	GULL WING	端子节距：	0.65 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	30
宽度：	12 mm

AD6645ASQ-105 数据手册

AD6645

ABSOLUTE MAXIMUM RATINGS

Table 5.

Values of θ_JAare provided for package comparison and PCB

design considerations. θ_JAcan be used for a first-order

approximation of T_Jby the equation

Parameter

Rating

Electrical

T_J= T_A+ (θ_JA× PD)

where:

AV_CCVoltage

DV_CCVoltage

0 V to 7 V

0 V to AV_CC

2ꢀ mA

0 V to AV_CC

4 mA

Analog Input Voltage

Analog Input Current

Digital Input Voltage

Digital Output Current

Environmental

Operating Temperature Range (Ambient)

AD664ꢀ-80

AD664ꢀ-10ꢀ

T_Ais the ambient temperature (°C).

PD is the power dissipation (W).

EXPLANATION OF TEST LEVELS

100% production tested.

−40°C to +8ꢀ°C

−10°C to +8ꢀ°C

1ꢀ0°C

300°C

−6ꢀ°C to +1ꢀ0°C

II. 100% production tested at 25°C and guaranteed by design

and characterization at temperature extremes.

Maximum Junction Temperature

Lead Temperature (Soldering, 10 sec)

Storage Temperature Range (Ambient)

III. Sample tested only.

IV. Parameter is guaranteed by design and characterization

testing.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Parameter is a typical value only.

ESD CAUTION

THERMAL RESISTANCE

The heat sink of the AD6645ASVZ, 52-lead TQFP_EP (SV-52-1)

package must be soldered to the PCB GND plane to meet thermal

specifications.

Table 6. Thermal Characteristics

Package Type

Rating

ꢀ2-Lead TQFP_EP

θ_JA(0 m/sec airflow)^{1, 2, 3}

θ_JMA(1.0 m/sec airflow)^{2, 3, 4, ꢀ}

θ_JC

23°C/W, soldered heat sink

17°C/W, soldered heat sink

2°C/W, soldered heat sink

6, 7

ꢀ2-Lead LQFP_PQ4

θ_JA(0 m/sec airflow)^{1, 2, 3}

θ_JMA(1.0 m/sec airflow)^{2, 3, 4, ꢀ}

θ_JA(0 m/sec airflow)^{1, 2, 3}

θ_JMA(1.0 m/sec airflow)^{2, 3, 4, ꢀ}

30°C/W, unsoldered heat sink

24°C/W, unsoldered heat sink

23°C/W, soldered heat sink

17°C/W, soldered heat sink

2°C/W

6, 7

θ_JC

¹Per JEDEC JESDꢀ1-2 (heat sink soldered to PCB).

²2S2P JEDEC test board.

³Values of θ_JAare provided for package comparison and PCB design

considerations.

⁴Per JEDEC JESDꢀ1-6 (heat sink soldered to PCB).

^ꢀAirflow increases heat dissipation, effectively reducing θ_JA. Furthermore, the

more metal that is directly in contact with the package leads from metal

traces, throughholes, ground, and power planes, the more θ_JAis reduced.

⁶Per MIL-STD-883, Method 1012.1.

⁷Values of θ_JCare provided for package comparison and PCB design

considerations when an external heat sink is required.

Rev. D | Page 7 of 24

1...4 5 678 9 10...24

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与AD6645ASQ-105相关器件

型号	品牌	描述	获取价格	数据表
AD6645ASQ-80	ADI	14-Bit, 80 MSPS A/D Converter	获取价格
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AD6645ASQZ-80	ADI	14-Bit, 80 MSPS/105 MSPS A/D Converter	获取价格
AD6645ASQZ-801	ADI	14-Bit, 80 MSPS/105 MSPS A/D Converter	获取价格
AD6645ASVZ-105	ADI	14-Bit, 80 MSPS/105 MSPS A/D Converter	获取价格

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