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ACPM-7813 PDF预览

ACPM-7813

更新时间： 2024-01-12 21:59:08
品牌 Logo 应用领域
安捷伦 - AGILENT 射频和微波射频放大器微波放大器功率放大器
页数 文件大小 规格书
21页 184K
描述
CDMA/AMPS Power Amplifier Module

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ACPM-7813 技术参数

是否Rohs认证： 符合生命周期：Obsolete
包装说明：SOLCC10,.16,32Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8542.33.00.01
风险等级：5.15特性阻抗：50 Ω
构造：COMPONENT增益：26 dB
最大输入功率 (CW)：10 dBm安装特点：SURFACE MOUNT
功能数量：1端子数量：10
最大工作频率：849 MHz最小工作频率：824 MHz
最高工作温度：85 °C最低工作温度：-30 °C
封装主体材料：PLASTIC/EPOXY封装等效代码：SOLCC10,.16,32
电源：3.4 V射频/微波设备类型：NARROW BAND MEDIUM POWER
子类别：RF/Microwave Amplifiers最大压摆率：563 mA
表面贴装：YES最大电压驻波比：2.5
Base Number Matches：1

ACPM-7813 数据手册

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form its phase from solid to  
liquids. The dwell time at melting The recommended solder paste is  
point 183°C shall maintain at type Sn6337A or Sn60Pb40A of  
between 60 to 150 seconds. Upon J-STD-006.  
Solder Paste  
Zone 1 – Preheat Zone  
The average heat up rate for  
surface-mount component on  
PCB shall be less than 3°C/  
second to allow even heating for  
both the component and PCB.  
This ramp is maintained until it  
reaches 100°C where flux  
activation starts.  
Note: Solder paste storage and shelf  
the duration of 10-20 seconds at  
peak temperature, it is then  
cooled down rapidly to allow the  
solder to freeze and form solid.  
life shall be in accordance with  
manufacturer’s specifications.  
Stencil or Screen  
The solder paste may be depos-  
ited onto PCB by either screen  
printing, using a stencil or  
syringe dispensing. The recom-  
mended stencil thickness is in  
accordance to JESD22-B102-C.  
Extended duration above the  
solder melting point can poten-  
tially damage temperature  
sensitive components and result  
in excessive inter-metallic growth  
that causes brittle solder joint,  
weak and unreliable connections.  
It can lead to unnecessary dam-  
age to the PC Board and discol-  
oration to component’s leads.  
Zone 2 – Soak Zone  
The flux is being activated here  
to prepare for even and smooth  
solder joint in subsequent zone.  
The temperature ramp is kept  
gradual to minimize thermal  
mismatch between solder, PC  
Board and components. Over-  
ramp rate here can cause solder  
splatter due to excessive oxida-  
tion of paste.  
Zone 4 – Cooling Zone  
The temperature ramp down rate  
is 6°C/second maximum. It is  
important to control the cooling  
rate as fast as possible in order  
to achieve the smaller grain size  
for solder and increase fatigue  
resistance of solder joint.  
Zone 3 – Reflow Zone  
The third process zone is the  
solder reflow zone. The tempera-  
ture in this zone rises rapidly  
from 183°C to peak temperature  
of 235°C for the solder to trans-  
Nominal stencil thickness  
Component lead pitch  
0.102 mm (0.004 in)  
0.152 mm (0.006 in)  
0.203 mm (0.008 in)  
Lead pitch less than 0.508 mm (0.020 in)  
0.508 mm to 0.635 mm (0.02 in to 0.025 in)  
Lead pitch greater than 0.635 mm (0.025 in)  
www.agilent.com/semiconductors  
For product information and a complete list of  
distributors, please go to our web site.  
For technical assistance call:  
Americas/Canada: +1 (800) 235-0312 or  
(916) 788-6763  
Europe: +49 (0) 6441 92460  
China: 10800 650 0017  
Hong Kong: (65) 6756 2394  
India, Australia, New Zealand: (65) 6755 1939  
Japan: (+81 3) 3335-8152(Domestic/International), or  
0120-61-1280(Domestic Only)  
Korea: (65) 6755 1989  
Singapore, Malaysia, Vietnam, Thailand, Philippines,  
Indonesia: (65) 6755 2044  
Taiwan: (65) 6755 1843  
Data subject to change.  
Copyright © 2004 Agilent Technologies, Inc.  
Obsoletes 5989-0404EN  
November 10, 2004  
5989-1900EN  
1...18192021

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