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A8516 PDF预览

A8516

更新时间: 2024-01-28 08:13:28
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器显示器电视
页数 文件大小 规格书
17页 554K
描述
The A8516 is a multi-output WLED/RGB driver for backlighting LCD monitors and televisions.

A8516 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:HTSSOP, TSSOP24,.25针数:24
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.71
接口集成电路类型:LED DISPLAY DRIVERJESD-30 代码:R-PDSO-G24
JESD-609代码:e3长度:7.8 mm
湿度敏感等级:2复用显示功能:NO
功能数量:1区段数:6
端子数量:24最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:HTSSOP封装等效代码:TSSOP24,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:12 V
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Display Drivers最大供电电压:24 V
最小供电电压:8 V标称供电电压:12 V
表面贴装:YES温度等级:INDUSTRIAL
端子面层:NOT SPECIFIED端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4.4 mm
Base Number Matches:1

A8516 数据手册

 浏览型号A8516的Datasheet PDF文件第11页浏览型号A8516的Datasheet PDF文件第12页浏览型号A8516的Datasheet PDF文件第13页浏览型号A8516的Datasheet PDF文件第14页浏览型号A8516的Datasheet PDF文件第15页浏览型号A8516的Datasheet PDF文件第16页 
LED Backlight Driver for LCD Monitors and Televisions  
A8516  
Package LP 24-Pin TSSOP with Exposed Thermal Pad  
0.65  
7.80±0.10  
0.45  
8º  
0º  
24  
0.20  
0.09  
B
3.00  
6.10  
3 NOM 4.40±0.10 6.40±0.20  
0.60 ±0.15  
1.00 REF  
A
1
2
4.32 NOM  
0.25 BSC  
1.65  
4.32  
PCB Layout Reference View  
SEATING PLANE  
GAUGE PLANE  
C
SEATING  
PLANE  
24X  
C
0.10  
C
0.30  
0.19  
0.65 BSC  
For Reference Only; not for tooling use (reference MO-153 ADT)  
Dimensions in millimeters  
1.20 MAX  
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions  
Exact case and lead configuration at supplier discretion within limits shown  
0.15  
0.00  
Terminal #1 mark area  
A
B
Exposed thermal pad (bottom surface); dimensions may vary with device  
C
Reference land pattern layout (reference IPC7351  
TSOP65P640X120-25M); all pads a minimum of 0.20 mm from all  
adjacent pads; adjust as necessary to meet application process  
requirements and PCB layout tolerances; when mounting on a multilayer  
PCB, thermal vias at the exposed thermal pad land can improve thermal  
dissipation (reference EIA/JEDEC Standard JESD51-5)  
Copyright ©2010-2011, Allegro MicroSystems, Inc.  
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-  
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the  
information being relied upon is current.  
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the  
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;  
nor for any infringement of patents or other rights of third parties which may result from its use.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
17  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  

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