Wide Input Voltage Range, High Efficiency
Fault Tolerant LED Driver
A8515
Pin-out Diagram
16
15
14
13
12
11
10
9
VDD
PGND
OVP
LED2
1
2
3
4
5
6
7
8
LED1
AGND
SW
ISET
PAD
GATE
VSENSE
VIN
FSET/SYNC
EN/PWM
APWM
COMP
FAULT
Terminal List Table
Number
Name
Function
1
2
VDD
Output of internal LDO; connect a 0.1 μF decoupling capacitor between this pin and GND.
PGND
Power ground for internal NMOS device.
This pin is used to sense an overvoltage condition; connect the ROVP resistor from VOUT to this
pin to adjust the Overvoltage Protection function (OVP).
3
OVP
4
5
SW
The drain of the internal NMOS switch of the boost converter.
GATE
Output gate driver pin for external P-channel FET control.
Connect this pin to the negative sense side of the current sense resistor RSC; the threshold
6
7
VSENSE
VIN
voltage is measured as VIN – VSENSE
.
Input power to the A8515 as well as the positive input used for the current sense resistor.
This pin is used to indicate a fault condition, it is an open drain type configuration that will be
pulled low when a fault occurs; connect a 100 kΩ resistor between this pin and the required
logic level voltage.
¯¯¯¯¯¯¯¯¯
FAULT
8
Output of the error amplifier and compensation node; connect a series RZCZ network from this
pin to GND for control loop compensation.
9
COMP
APWM
Analog trimming option or dimming; applying a digital PWM signal to this pin adjusts the internal
ISET current.
10
11
PWM dimming pin used to control the LED intensity by using pulse width modulation; the typical
PWM dimming frequency is in the range of 200 Hz to 1 kHz.
EN/PWM
Frequency/synchronization pin; connect a resistor RFSET from this pin to GND to set the
12
FSET/SYNC switching frequency. This pin can also be used to synchronize two or more converters in the
system; the maximum synchronization frequency is 2.3 MHz.
13
14
15
16
ISET
AGND
LED1
LED2
Connect the RISET resistor between this pin and GND to set the LED 100% current level.
LED signal ground.
Connect the cathode of the LED string to this pin.
Connect the cathode of the LED string to this pin.
Exposed pad of the package providing enhanced thermal dissipation; this pad must be
connected to the ground plane(s) of the PCB with at least 8 thermal vias, directly in the pad.
–
PAD
Allegro MicroSystems, Inc.
115 Northeast Cutoff
3
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com