Datasheet > A3983_10

A3983_10

更新时间： 2022-05-19 05:41:53

品牌	Logo	应用领域
急速微 - ALLEGRO		驱动器转换器电机
页数	文件大小	规格书
12页	353K
描述
The A3983 is a complete microstepping motor driver with built-in translator for easy operation.

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A3983_10 数据手册

A3983

DMOS Microstepping Driver with Translator

Application Layout

be created using the exposed thermal pad under the device, to

serve both as a low impedance ground point and thermal path.

Layout. The printed circuit board should use a heavy ground-

plane. For optimum electrical and thermal performance, the

A3983 must be soldered directly onto the board. On the under-

side of the A3983 package is an exposed pad, which provides a

The two input capacitors should be placed in parallel, and as

close to the device supply pins as possible. The ceramic capaci-

path for enhanced thermal dissipation. The thermal pad should be tor (CIN1) should be closer to the pins than the bulk capacitor

(CIN2). This is necessary because the ceramic capacitor will be

responsible for delivering the high frequency current components.

The sense resistors, RSx, should have a very low impedance

path to ground, because they must carry a large current while

supporting very accurate voltage measurements by the current

sense comparators. Long ground traces will cause additional

voltage drops, adversely affecting the ability of the comparators

to accurately measure the current in the windings. The SENSEx

pins have very short traces to the RSx resistors and very thick,

low impedance traces directly to the star ground underneath the

device. If possible, there should be no other components on the

sense circuits.

soldered directly to an exposed surface on the PCB. Thermal vias

are used to transfer heat to other layers of the PCB.

In order to minimize the effects of ground bounce and offset

issues, it is important to have a low impedance single-point

ground, known as a star ground, located very close to the device.

By making the connection between the pad and the ground plane

directly under the A3983, that area becomes an ideal location for

a star ground point. A low impedance ground will prevent ground

bounce during high current operation and ensure that the supply

voltage remains stable at the input terminal. The star ground can

Solder

A3983

Trace (2 oz.)

Signal (1 oz.)

Ground (1 oz.)

PCB

Thermal (2 oz.)

Thermal Vias

OUT2B

GND

A3983

GND

CP1

GND

ENABLE

OUT2B

CP2

VCP

OUT2A

OUT1A

VBB2

SENSE2

OUT2A

OUT1A

SENSE1

VBB1

PAD

VREG

ROSC

MS1

MS2

GND

RESET

ROSC

SLEEP

OUT1B

DIR

BULK

VDD

STEP

REF

GND

CAPACITANCE

V_DD

VDD

VBB

Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036 (508) 853-5000

www.allegromicro.com

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