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A3959SB PDF预览

A3959SB

更新时间: 2024-01-29 14:16:14
品牌 Logo 应用领域
急速微 - ALLEGRO 驱动器运动控制电子器件信号电路光电二极管电动机控制电机
页数 文件大小 规格书
12页 275K
描述
DMOS FULL-BRIDGE PWM MOTOR DRIVER

A3959SB 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:HTSSOP, TSSOP28,.25针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:1.06
模拟集成电路 - 其他类型:STEPPER MOTOR CONTROLLERJESD-30 代码:R-PDSO-G28
JESD-609代码:e3长度:9.7 mm
湿度敏感等级:2功能数量:1
端子数量:28最高工作温度:85 °C
最低工作温度:-20 °C最大输出电流:6 A
封装主体材料:PLASTIC/EPOXY封装代码:HTSSOP
封装等效代码:TSSOP28,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):260
电源:5 V认证状态:Not Qualified
座面最大高度:1.2 mm子类别:Motion Control Electronics
最大供电电流 (Isup):10 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:NMOS
温度等级:OTHER端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:40
宽度:4.4 mmBase Number Matches:1

A3959SB 数据手册

 浏览型号A3959SB的Datasheet PDF文件第4页浏览型号A3959SB的Datasheet PDF文件第5页浏览型号A3959SB的Datasheet PDF文件第6页浏览型号A3959SB的Datasheet PDF文件第8页浏览型号A3959SB的Datasheet PDF文件第9页浏览型号A3959SB的Datasheet PDF文件第10页 
3959  
DMOS FULL-BRIDGE  
PWM MOTOR DRIVER  
FUNCTIONAL DESCRIPTION (continued)  
Current Sensing. To minimize inaccuracies in sensing  
the ITRIP current level, which may be caused by ground  
trace IR drops, the sense resistor should have an  
independent ground return to the ground terminal of the  
device. For low-value sense resistors the IR drops in the  
PCB sense resistor’s traces can be significant and should  
be taken into account. The use of sockets should be  
avoided as they can introduce variation in RS due to their  
contact resistance.  
Layout. A star ground system located close to the driver  
is recommended. The printed wiring board should use a  
heavy ground plane. For optimum electrical and thermal  
performance*, the driver should be soldered directly onto  
the board. The ground side of RS should have an indi-  
vidual path to the ground terminals of the device. This  
path should be as short as is possible physically and  
should not have any other components connected to it. It  
is recommended that a 0.1 µF capacitor be placed between  
SENSE and ground as close to the device as possible; the  
load supply terminal, VBB, should be decoupled with an  
electrolytic capacitor (> 47 µF is recommended) placed as  
close to the device as is possible. On the 28-lead TSSOP  
package, the copper ground plane located under the  
exposed thermal pad is typically used as a star ground.  
The maximum value of RS is given as RS 0.5/ITRIP  
where ITRIP 3.0 A.  
Thermal Protection. Circuitry turns off all drivers  
when the junction temperature reaches 165°C typically. It  
is intended only to protect the device from failures due to  
excessive junction temperatures and should not imply that  
output short circuits are permitted. Thermal shutdown has  
a hysteresis of approximately 15°C.  
* The thermal resistance, RθJA, and absolute maximum  
allowable package power dissipation specified on page 1  
is measured on a typical two-sided PCB with one square  
inch copper ground area on each side. With minimal  
copper on a single-sided PCB (worst-case), the ‘B’  
package RθJA is 40°C/W, ‘LB’ is 77°C/W, and ‘LP’ is  
80°C/W. See also, Application Note 29501.5, Improving  
Batwing Power Dissipation.  
5
SUFFIX 'B', RθJA = 26°C/W  
SUFFIX 'LP', RθJA = 28°C/W  
SUFFIX 'LB', RθJA = 35°C/W  
4
3
MULTI-LAYER HIGH-K BOARD  
For specification purposes, the multi-layer high-K board  
performance graphed here is per JEDEC Standard  
JESD51.  
2
1
0
The products described here are manufactured under one or more  
U.S. patents or U.S. patents pending.  
Allegro MicroSystems, Inc. reserves the right to make, from time to  
time, such departures from the detail specifications as may be  
required to permit improvements in the performance, reliability, or  
manufacturability of its products. Before placing an order, the user is  
cautioned to verify that the information being relied upon is current.  
SUFFIX 'B', RθJA = 38°C/W  
SUFFIX 'LP', RθJA = 40°C/W  
SUFFIX 'LB', RθJA = 50°C/W  
DOUBLE-SIDED BOARD,  
1 SQ. IN. COPPER EA. SIDE  
Allegro products are not authorized for use as critical components  
in life-support devices or systems without express written approval.  
25  
50  
75  
100  
125  
150  
°
TEMPERATURE IN C  
The information included herein is believed to be accurate and  
reliable. However, Allegro MicroSystems, Inc. assumes no responsi-  
bility for its use; nor for any infringement of patents or other rights of  
third parties which may result from its use.  
Dwg. GP-049-6  
www.allegromicro.com  
7

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