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A3425LK-T PDF预览

A3425LK-T

更新时间: 2024-01-10 00:41:13
品牌 Logo 应用领域
急速微 - ALLEGRO 模拟IC开关信号电路信息通信管理
页数 文件大小 规格书
21页 574K
描述
Ultra-Sensitive Dual-Channel Quadrature Hall-Effect Bipolar Switch

A3425LK-T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOIC-8针数:8
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.8模拟集成电路 - 其他类型:ANALOG CIRCUIT
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
长度:4.9 mm功能数量:1
端子数量:8最高工作温度:150 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.75 mm
最大供电电压 (Vsup):18 V最小供电电压 (Vsup):3.3 V
标称供电电压 (Vsup):12 V表面贴装:YES
技术:BICMOS温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:3.9 mm
Base Number Matches:1

A3425LK-T 数据手册

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A3425  
Ultra-Sensitive Dual-Channel Quadrature Hall-Effect Bipolar Switch  
Typical Thermal Performance  
The device must be operated below the maximum junction  
Example: Reliability for VCC at TA=150°C, package L, using  
minimum-K PCB  
temperature of the device, TJ(max). Under certain combinations of  
peak conditions, reliable operation may require derating sup-  
plied power or improving the heat dissipation properties of the  
application. This section presents a procedure for correlating  
factors affecting operating TJ. (Thermal data is also available on  
the Allegro MicroSystems Web site.)  
Observe the worst-case ratings for the device, specically:  
R
θJA=140°C/W, TJ(max) =165°C, VCC(max)=18V, and  
ICC(max) = 6mA.  
Calculate the maximum allowable power level, PD(max). First,  
invert equation 3:  
The Package Thermal Resistance, RθJA, is a gure of merit sum-  
marizing the ability of the application and the device to dissipate  
heat from the junction (die), through all paths to the ambient air.  
Its primary component is the Effective Thermal Conductivity,  
K, of the printed circuit board, including adjacent devices and  
traces. Radiation from the die through the device case, RθJC, is  
relatively small component of RθJA. Ambient air temperature,  
TA, and air motion are signicant external factors, damped by  
overmolding.  
Tmax = TJ(max) – TA = 165°C150°C = 15°C  
This provides the allowable increase to TJ resulting from internal  
power dissipation. Then, invert equation 2:  
PD(max) = Tmax ÷RθJA =1C÷140 °C/W=107mW  
Finally, invert equation 1 with respect to voltage:  
V
CC(est) = PD(max) ÷ ICC(max) = 107mW÷6mA=18 V  
The effect of varying power levels (Power Dissipation, PD), can  
be estimated. The following formulas represent the fundamental  
relationships used to estimate TJ, at PD.  
The result indicates that, at TA, the application and device can  
dissipate adequate amounts of heat at voltages VCC(est)  
.
Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reli-  
able operation between VCC(est) and VCC(max) requires enhanced  
PD = VIN  
I
(1)  
(2)  
(3)  
×
IN  
R
θJA. If VCC(est) VCC(max), then operation between VCC(est) and  
T = PD  
R
θJA  
×
VCC(max) is reliable under these conditions.  
TJ = TA + T  
For example, given common conditions such as: TA= 25°C,  
VCC = 12 V, ICC = 4 mA, and RθJA = 140 °C/W, then:  
PD = VCC  
I
= 12 V 4 mA = 48 mW  
×
×
CC  
T = PD  
R
= 48 mW 140 °C/W = 7°C  
×
×
θJA  
TJ = TA + T = 25°C + 7°C = 32°C  
A worst-case estimate, PD(max), represents the maximum allow-  
able power level (VCC(max), ICC(max)), without exceeding TJ(max)  
at a selected RθJA and TA.  
,
Allegro MicroSystems, Inc.  
10  
115 Northeast Cutoff, Box 15036  
A3425DS-Rev. !  
Worcester, Massachusetts 01615-0036 (508) 853-5000  
www.allegromicro.com  

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