5秒后页面跳转
A2F060M3E-FGG256I PDF预览

A2F060M3E-FGG256I

更新时间: 2024-02-23 08:00:43
品牌 Logo 应用领域
美高森美 - MICROSEMI 现场可编程门阵列可编程逻辑
页数 文件大小 规格书
192页 11779K
描述
SmartFusion Customizable System-on-Chip (cSoC)

A2F060M3E-FGG256I 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:LBGA, BGA256,16X16,40Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.82
最大时钟频率:80 MHzJESD-30 代码:S-PBGA-B256
JESD-609代码:e1长度:17 mm
湿度敏感等级:3可配置逻辑块数量:1536
等效关口数量:60000输入次数:66
逻辑单元数量:1536输出次数:66
端子数量:256组织:1536 CLBS, 60000 GATES
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装等效代码:BGA256,16X16,40封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):250
电源:1.5,1.8,2.5,3.3 V可编程逻辑类型:FIELD PROGRAMMABLE GATE ARRAY
认证状态:Not Qualified座面最大高度:1.7 mm
子类别:Field Programmable Gate Arrays最大供电电压:1.575 V
最小供电电压:1.425 V标称供电电压:1.5 V
表面贴装:YES技术:CMOS
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:30宽度:17 mm
Base Number Matches:1

A2F060M3E-FGG256I 数据手册

 浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第6页浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第7页浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第8页浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第10页浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第11页浏览型号A2F060M3E-FGG256I的Datasheet PDF文件第12页 
1 – SmartFusion Family Overview  
Introduction  
The SmartFusion® family of cSoCs builds on the technology first introduced with the Fusion mixed signal  
FPGAs. SmartFusion cSoCs are made possible by integrating FPGA technology with programmable  
high-performance analog and hardened ARM Cortex-M3 microcontroller blocks on a flash semiconductor  
process. The SmartFusion cSoC takes its name from the fact that these three discrete technologies are  
integrated on a single chip, enabling the lowest cost of ownership and smallest footprint solution to you.  
General Description  
Microcontroller Subsystem (MSS)  
The MSS is composed of a 100 MHz Cortex-M3 processor and integrated peripherals, which are  
interconnected via a multi-layer AHB bus matrix (ABM). This matrix allows the Cortex-M3 processor,  
FPGA fabric master, Ethernet message authentication controller (MAC), when available, and peripheral  
DMA (PDMA) controller to act as masters to the integrated peripherals, FPGA fabric, embedded  
nonvolatile memory (eNVM), embedded synchronous RAM (eSRAM), external memory controller  
(EMC), and analog compute engine (ACE) blocks.  
SmartFusion cSoCs of different densities offer various sets of integrated peripherals. Available  
peripherals include SPI, I2C, and UART serial ports, embedded FlashROM (EFROM), 10/100 Ethernet  
MAC, timers, phase-locked loops (PLLs), oscillators, real-time counters (RTC), and peripheral DMA  
controller (PDMA).  
Programmable Analog  
Analog Front-End (AFE)  
SmartFusion cSoCs offer an enhanced analog front-end compared to Fusion devices. The successive  
approximation register analog-to-digital converters (SAR ADC) are similar to those found on Fusion  
devices. SmartFusion cSoC also adds first order sigma-delta digital-to-analog converters (SDD DAC).  
SmartFusion cSoCs can handle multiple analog signals simultaneously with its signal conditioning blocks  
(SCBs). SCBs are made of a combination of active bipolar prescalers (ABPS), comparators, current  
monitors and temperature monitors. ABPS modules allow larger bipolar voltages to be fed to the ADC.  
Current monitors take the voltage across an external sense resistor and convert it to a voltage suitable  
for the ADC input range. Similarly, the temperature monitor reads the current through an external PN-  
junction (diode or transistor) and converts it internally for the ADC. The SCB also includes comparators  
to monitor fast signal thresholds without using the ADC. The output of the comparators can be fed to the  
analog compute engine or the ADC.  
Analog Compute Engine (ACE)  
The mixed signal blocks found in SmartFusion cSoCs are controlled and connected to the rest of the  
system via a dedicated processor called the analog compute engine (ACE). The role of the ACE is to  
offload control of the analog blocks from the Cortex-M3, thus offering faster throughput or better power  
consumption compared to a system where the main processor is in charge of monitoring the analog  
resources. The ACE is built to handle sampling, sequencing, and post-processing of the ADCs, DACs,  
and SCBs.  
Revision 10  
1-1  

与A2F060M3E-FGG256I相关器件

型号 品牌 描述 获取价格 数据表
A2F060M3E-FGG256Y MICROSEMI SmartFusion Customizable System-on-Chip (cSoC)

获取价格

A2F060M3E-FGG256Y ACTEL Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA256, 1 MM PITCH, GREEN, F

获取价格

A2F060M3E-FGG256YC MICROSEMI FPGA

获取价格

A2F060M3E-FGG256YES MICROSEMI SmartFusion Customizable System-on-Chip (cSoC)

获取价格

A2F060M3E-FGG256YI MICROSEMI SmartFusion Customizable System-on-Chip (cSoC)

获取价格

A2F060M3E-FGG256YI ACTEL Field Programmable Gate Array, 1536 CLBs, 60000 Gates, CMOS, PBGA256, 1 MM PITCH, GREEN, F

获取价格