A29DL16x Series
ERASE AND PROGRAMMING PERFORMANCE
Parameter
Sector Erase Time
Typ. (Note 1)
Max. (Note 2)
Unit
sec
sec
µs
Comments
0.7
27
5
15
Excludes 00h programming
prior to erasure (Note 4)
Chip Erase Time
Byte Programming Time
150
210
120
27
Word Programming Time
Accelerated Word/Byte Programming Time
7
µs
Excludes system-level
overhead (Note 5)
4
µs
Chip Programming Time
(Note 3)
Byte Mode
Word Mode
9
sec
sec
6
18
Notes:
1. Typical program and erase times assume the following conditions: 25°C, 3.0V VCC, 10,000 cycles. Additionally, programming
typically assumes checkerboard pattern.
2. Under worst case conditions of 90°C, VCC = 2.7V, 100,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes
program faster than the maximum byte program time listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the four-bus-cycle command sequence for programming. See Table 12
for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 10,000 cycles.
LATCH-UP CHARACTERISTICS
Description
Min.
-1.0V
Max.
VCC+1.0V
+100 mA
12.5V
Input Voltage with respect to VSS on all I/O pins
VCC Current
-100 mA
-1.0V
Input voltage with respect to VSS on all pins except I/O pins
(including A9,
and
)
RESET
OE
Includes all pins except VCC. Test conditions: VCC = 3.0V, one pin at time.
PACKAGE AND PIN CAPACITANCE
Parameter Symbol
Parameter Description
Test Setup
Typ.
Max.
Unit
TSOP
BGA
6
7.5
5
pF
pF
pF
pF
pF
pF
CIN
Input Capacitance
VIN=0
4.2
8.5
5.4
7.5
3.9
TSOP
BGA
12
6.5
9
COUT
Output Capacitance
VOUT=0
VIN=0
TSOP
BGA
CIN2
Control Pin Capacitance
4.7
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0MHz
DATA RETENTION
Parameter
Test Conditions
150°C
Min
Unit
Years
Years
10
20
Minimum Pattern Data Retention Time
125°C
PRELIMINARY (September, 2004, Version 0.0)
42
AMIC Technology, Corp.