Datasheet > A1F25M12W2-F1

A1F25M12W2-F1

更新时间： 2023-12-20 18:46:19

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		电源电路
页数	文件大小	规格书
16页	546K
描述
ACEPACK 1电源模块，fourpack拓扑，1200 V，23 mOhm（典型值），SiC MOSFET第二代（配NTC）

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A1F25M12W2-F1 数据手册

A1F25M12W2-F1

Datasheet

ACEPACK 1 power module, fourpack topology, 1200 V, 25 mΩ typ.

SiC MOSFET gen.2 with NTC

Features

•

ACEPACK 1 power module:

–

DBC Cu-Al₂O₃-Cu based

Insulation voltage UL certified of 2.5 kVrms

Press-fit contact pins

Fourpack topology:

–

1200 V SiC MOSFET

R_DS(on)typical 25 mΩ

ACEPACK 1

Very high-power density

Very low switching energies

Switching characteristic almost independent from temperature

DC+

•

Integrated NTC temperature sensor

Applications

AC1

AC2

•

DC/DC converter

High frequency switching application

Welding

DC1-

DC2-

Description

This power module features a fourpack topology in an ACEPACK 1 module with NTC

and integrates the most advanced silicon carbide MOSFETs of STMicroelectronics

which are represented by the gen.2 technology. This modular solution can be used to

realize complex topologies characterized by very high power density in order to meet

the higest efficiency requirements.

Product status link

A1F25M12W2-F1

Product summary

Order code

Marking

A1F25M12W2-F1

ACEPACK 1

Tray

Package

Packing

Leads type

Press-fit

DS13470 - Rev 4 - April 2023

For further information contact your local STMicroelectronics sales office.

www.st.com

12 3 4 5 6 7...16

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