ACT 2 Family FPGAs
Product Plan
Speed Grade1
–1
Application1
Device/Package
Std.
–2
C
I
M
B
A1225A Device
84-Pin Plastic Leaded Chip Carrier (PL)
✓
✓
✓
✓
–
–
–
–
–
–
–
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
–
100-Pin Plastic Quad Flatpack (PQ)
100-Pin Very Thin Quad Flatpack (VQ)
100-Pin Ceramic Pin Grid Array (PG)
–
A1240A Device
84-Pin Plastic Leaded Chip Carrier (PL)
✓
✓
✓
✓
–
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
–
132-Pin Ceramic Pin Grid Array (PG)
144-Pin Plastic Quad Flat Pack (PQ)
176-Pin Thin (1.4 mm) Quad Flat Pack (TQ)
✓
–
✓
–
✓
–
–
–
A1280A Device
160-Pin Plastic Quad Flatpack (PQ)
✓
✓
✓
✓
–
–
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
✓
–
172-Pin Ceramic Quad Flatpack (CQ)
176-Pin Ceramic Pin Grid Array (PG)
176-Pin Thin (1.4 mm) Quad Flat Pack (TQ)
✓
✓
–
✓
✓
–
–
–
Notes:
Availability:
Speed Grade:
–1 = Approx. 15% faster than Std.
–2 = Approx. 25% faster than Std.
1. Applications:
C = Commercial
I = Industrial
M = Military
✓ = Available
P = Planned
– = Not planned
B = MIL-STD-883
2. Contact your Microsemi SoC Products Group sales representative for product availability.
Device Resources
User I/Os
Device
Series
Logic
Modules Gates
PG176 PG132 PG100 PQ160 PQ144 PQ100
PL84
72
CQ172 TQ176 VQ100
A1225A
A1240A
A1280A
451
684
2,500
4,000
8,000
–
–
–
104
–
83
–
–
–
–
104
–
83
–
–
–
–
83
–
72
104
140
1,232
140
–
125
–
72
140
–
Contact your local Microsemi SoC Products Group representative for device availability:
http://www.microsemi.com/soc/contact/default.aspx.
Revision 8
III